Multilayer electronic component

ABSTRACT

A multilayer electronic component includes a body including a dielectric layer and a first internal electrode and a second internal electrode having first to sixth surfaces, a first external electrode including a first connection portion on the third surface, a first band portion on a portion of the first surface, and a third band portion on a portion of the second surface, a second external electrode including a second connection portion on the fourth surface, a second band portion on a portion of the first surface, and a fourth band portion on a portion of the second surface, an insulating layer disposed on the first and second connection portions and covering the second surface and the third and fourth band portions, a first plating layer disposed on the first band portion, and a second plating layer disposed on the second band portion. The insulating layer includes an oxide containing Ba.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application claims benefit of priority to Korean Patent ApplicationNo. 10-2021-0194533 filed on Dec. 31, 2021 in the Korean IntellectualProperty Office, the disclosure of which is incorporated herein byreference in its entirety.

TECHNICAL FIELD

The present disclosure relates to a multilayer electronic component.

BACKGROUND

A multilayer ceramic capacitor (MLCC), a multilayer electroniccomponent, is a chip-type capacitor that charges or dischargeselectricity while mounted on the printed circuit board of variouselectronic products, such as imaging devices including Liquid CrystalDisplay (LCD) and Plasma Display Panel (PDP), computers, smartphonesmobile phones, and the like.

Such a multilayer ceramic capacitor may be used as a component ofvarious electronic devices due to a small size, high capacitance, andease of mounting thereof. As various electronic devices such ascomputers and mobile devices are miniaturized and have high output,demand for miniaturization and high capacitance multilayer ceramiccapacitors is increasing.

In addition, as industry interest in automotive electronic componentshas recently increased, multilayer ceramic capacitors are also requiredto have high reliability characteristics to be used in automobiles orinfotainment systems.

To miniaturize and increase the capacitance of a multilayer ceramiccapacitor, it is necessary to increase the number of layers thereof byforming thin internal electrodes and dielectric layers, and it isnecessary to increase the effective volume fraction required forcapacitance implementation by significantly reducing the volume of theportion that does not affect capacitance formation.

In addition, to mount as many components as possible within the limitedarea of the board, it is necessary to significantly reduce the mountingspace.

In addition, as the thickness of the margin decreases withminiaturization and high capacitance of the multilayer ceramiccapacitor, external moisture penetration or penetration of a platingsolution may be facilitated, and thus reliability may be weakened.Accordingly, there is a need for a method capable of protecting themultilayer ceramic capacitor from the penetration of external moistureor the penetration of a plating solution.

SUMMARY

An aspect of the present disclosure is to provide a multilayerelectronic component having improved capacitance per unit volume.

An aspect of the present disclosure is to provide a multilayerelectronic component having improved reliability.

An aspect of the present disclosure is to provide a multilayerelectronic component in which a mounting space may be significantlyreduced.

According to an aspect of the present disclosure, a multilayerelectronic component includes a body having a dielectric layer and afirst internal electrode and a second internal electrode alternatelydisposed with the dielectric layer interposed therebetween, the bodyhaving a first surface and a second surface opposing each other in afirst direction, a third surface and a fourth surface connected to thefirst and second surfaces and opposing each other in a second direction,and a fifth surface and a sixth surface connected to the first to fourthsurfaces and opposing each other in a third direction; a first externalelectrode including a first connection portion disposed on the thirdsurface, and a first band portion extending from the first connectionportion onto a portion of the first surface; a second external electrodeincluding a second connection portion disposed on the fourth surface,and a second band portion extending from the second connection portiononto a portion of the first surface; an insulating layer disposed on thefirst and second connection portions and including an oxide containingBa; a first plating layer disposed on the first band portion; and asecond plating layer disposed on the second band portion.

According to an aspect of the present disclosure, a multilayerelectronic component includes a body having a dielectric layer and firstand second internal electrodes alternately disposed with the dielectriclayer interposed therebetween, the body having a first surface and asecond surface opposing each other in a first direction, a third surfaceand a fourth surface connected to the first and second surfaces andopposing each other in a second direction, and a fifth surface and asixth surface connected to the first to fourth surfaces and opposingeach other in a third direction; a first external electrode including afirst connection portion disposed on the third surface, a first bandportion extending from the first connection portion onto a portion ofthe first surface, and a third band portion extending from the firstconnection portion to a portion of the second surface; a second externalelectrode including a second connection portion disposed on the fourthsurface, a second band portion extending from the second connectionportion onto a portion of the first surface, and a fourth band portionextending from the second connection portion to a portion of the secondsurface; an insulating layer disposed on the first and second connectionportions, disposed to cover the second surface and the third and fourthband portions, and including an oxide containing Ba; a first platinglayer disposed on the first band portion; and a second plating layerdisposed on the second band portion.

According to an aspect of the present disclosure, a multilayerelectronic component includes a body having g a dielectric layer, and afirst internal electrode and a second internal electrode alternatelydisposed with the dielectric layer interposed therebetween, the bodyhaving a first surface and a second surface opposing each other in afirst direction, a third surface and a fourth surface connected to thefirst and second surfaces and opposing each other in a second direction,and a fifth surface and a sixth surface connected to the first to fourthsurfaces and opposing each other in a third direction; a first externalelectrode including a first connection portion disposed on the thirdsurface, and a first band portion extending from the first connectionportion onto a portion of the first surface; a second external electrodeincluding a second connection portion disposed on the fourth surface,and a second band portion extending from the second connection portiononto a portion of the first surface; an insulating layer disposed on thesecond surface, extending over the first and second connection portions,and including an oxide containing Ba; a first plating layer disposed onthe first band portion; and a second plating layer disposed on thesecond band portion. The first and second external electrodes aredisposed below an extension line of the second surface.

BRIEF DESCRIPTION OF DRAWINGS

The above and other aspects, features, and advantages of the presentdisclosure will be more clearly understood from the following detaileddescription, taken in conjunction with the accompanying drawings, inwhich:

FIG. 1 schematically illustrates a multilayer electronic componentaccording to an embodiment;

FIG. 2 schematically illustrates a body of the multilayer electroniccomponent of FIG. 1 ;

FIG. 3 is a cross-sectional view taken along line I-I′ of FIG. 1 ;

FIG. 4 is an exploded perspective view schematically illustrating anexploded body of FIG. 2 ;

FIG. 5 is a schematic perspective view of a board on which themultilayer electronic component of FIG. 1 is mounted;

FIG. 6 is a schematic perspective view of a multilayer electroniccomponent according to an embodiment;

FIG. 7 is a cross-sectional view taken along line II-II′ of FIG. 6 ;

FIG. 8 is a schematic perspective view of a multilayer electroniccomponent according to an embodiment;

FIG. 9 is a cross-sectional view taken along line III-III′ of FIG. 8 ;

FIG. 10 is a schematic perspective view of a multilayer electroniccomponent according to an embodiment;

FIG. 11 is a cross-sectional view taken along line IV-IV′ of FIG. 10 ;

FIG. 12 is a schematic perspective view of a multilayer electroniccomponent according to an embodiment;

FIG. 13 is a cross-sectional view taken along line V-V′ of FIG. 12 ;

FIG. 14 is a schematic perspective view of a multilayer electroniccomponent according to an embodiment;

FIG. 15 is a cross-sectional view taken along line VI-VI′ of FIG. 14 ;

FIG. 16 illustrates a modified example of FIG. 14 ;

FIG. 17 is a schematic perspective view of a multilayer electroniccomponent according to an embodiment;

FIG. 18 is a cross-sectional view taken along line VII-VII′ of FIG. 17 ;

FIG. 19 is a schematic perspective view of a multilayer electroniccomponent according to an embodiment;

FIG. 20 is a cross-sectional view taken along line XIV-XIV′ of FIG. 19 ;

FIG. 21 is a schematic perspective view of a multilayer electroniccomponent according to an embodiment;

FIG. 22 is a cross-sectional view taken along line VIII-VIII′ of FIG. 21;

FIG. 23 illustrates a modified example of FIG. 21 ;

FIG. 24 is a schematic perspective view of a multilayer electroniccomponent according to an embodiment;

FIG. 25 is a cross-sectional view taken along line IX-IX′ of FIG. 24 ;

FIG. 26 illustrates a modified example of FIG. 24 ;

FIG. 27 is a schematic perspective view of a multilayer electroniccomponent according to an embodiment;

FIG. 28 is a cross-sectional view taken along line X-X′ of FIG. 27 ;

FIG. 29 illustrates a modified example of FIG. 27 ;

FIG. 30 is a schematic perspective view of a multilayer electroniccomponent according to an embodiment;

FIG. 31 is a cross-sectional view taken along line XI-XI′ of FIG. 30 ;

FIG. 32 illustrates a modified example of FIG. 30 ;

FIG. 33 is a schematic perspective view of a multilayer electroniccomponent according to an embodiment;

FIG. 34 is a cross-sectional view taken along line XII-XII′ of FIG. 33 ;

FIG. 35 is a schematic perspective view of a multilayer electroniccomponent according to an embodiment;

FIG. 36 is a cross-sectional view taken along line XIII-XIII′ of FIG. 35;

FIG. 37 illustrates a modified example of FIG. 35 ;

FIG. 38 is a schematic perspective view of a multilayer electroniccomponent according to an embodiment;

FIG. 39 is a cross-sectional view taken along line XV-XV′ of FIG. 38 ;

FIG. 40 is a schematic perspective view of a multilayer electroniccomponent according to an embodiment;

FIG. 41 is a cross-sectional view taken along line XVI-XVI′ of FIG. 40 ;and

FIG. 42 is an enlarged view of an area K1 of FIG. 40 .

DETAILED DESCRIPTION

Hereinafter, embodiments of the present disclosure will be describedwith reference to detailed embodiments and the accompanying drawings.However, the embodiment may be modified in various other forms, and thescope of the present disclosure is not limited to the embodimentsdescribed below. Further, the embodiments of the present disclosure areprovided to describe the present disclosure in more detail to thoseskilled in the art. Accordingly, the shapes and sizes of elements in thedrawings may be exaggerated for a clearer understanding, and elementsindicated by the same reference numerals in the drawings are the sameelements.

To clearly explain the present disclosure in the drawings, portionsirrelevant to the description are omitted, and the size and thickness ofrespective components illustrated in the drawings are arbitrarilyindicated for convenience of description, so the present disclosure isnot necessarily limited to the illustration. In addition, componentshaving the same function within the scope of the same concept will bedescribed using the same reference numerals. Furthermore, throughout thespecification, when a part “includes” a certain element, it means thatother elements may be further included, rather than excluding otherelements, unless otherwise stated.

The term “an exemplary embodiment” used herein does not refer to thesame exemplary embodiment, and is provided to emphasize a particularfeature different from that of another exemplary embodiment. However,exemplary embodiments provided herein may be implemented by beingcombined in whole or in part one with one another. For example, oneelement described in a particular exemplary embodiment may be understoodas a description related to another exemplary embodiment even if it isnot described in another exemplary embodiment, unless an opposite orcontradictory description is provided therein.

In the drawings, a first direction may be defined as a thickness (T)direction, a second direction may be defined as a length (L) direction,and a third direction may be defined as a width (W) direction.

FIG. 1 schematically illustrates a multilayer electronic componentaccording to an embodiment.

FIG. 2 schematically illustrates a body of the multilayer electroniccomponent of FIG. 1 .

FIG. 3 is a cross-sectional view taken along line I-I′ of FIG. 1 .

FIG. 4 is an exploded perspective view schematically illustrating anexploded body of FIG. 2 .

FIG. 5 is a schematic perspective view of a board on which themultilayer electronic component of FIG. 1 is mounted.

Hereinafter, a multilayer electronic component 1000 according to anembodiment will be described with reference to FIGS. 1 to 5 .

A multilayer electronic component 1000 according to an embodiment mayinclude a body 110 including a dielectric layer 111, and first andsecond internal electrodes 121 and 122 alternately disposed with thedielectric layer 111 interposed therebetween, and having first andsecond surfaces 1 and 2 opposing each other in a first direction, thirdand fourth surfaces 3 and 4 connected to the first and second surfaces 1and 2 and opposing each other in a second direction, and fifth and sixthsurfaces 5 and 6 connected to the first to fourth surfaces 1 to 4 andopposing each other in a third direction; a first external electrode 131including a first connection portion 131 a disposed on the third surface3, and a first band portion 131 b extending from the first connectionportion 131 a onto a portion of the first surface 1; a second externalelectrode 132 including a second connection portion 132 a disposed onthe fourth surface 4, and a second band portion 132 b extending from thesecond connection portion 132 a onto a portion of the first surface 1;an insulating layer 151 disposed on the first and second connectionportions 131 a and 132 a and including an oxide containing Ba; a firstplating layer 141 disposed on the first band portion 131 b; and a secondplating layer 142 disposed on the second band portion 132 b.

In the body 110, the dielectric layer 111 and the internal electrodes121 and 122 are alternately stacked.

A detailed shape of the body 110 is not particularly limited, but asillustrated, the body 110 may have a hexahedral shape or a similarshape. Due to the shrinkage of the ceramic powder included in the body110 during the firing process, the body 110 may not have a perfectlystraight hexahedral shape, but may have a substantially hexahedralshape.

The body 110 may have the first and second surfaces 1 and 2 opposingeach other in the first direction, the third and fourth surfaces 3 and 4connected to the first and second surfaces 1 and 2 and opposing eachother in the second direction, and the fifth and sixth surfaces 5 and 6connected to the first and second surfaces 1 and 2, connected to thethird and fourth surfaces 3 and 4, and opposing each other in the thirddirection.

In an embodiment, the body 110 may include a 1-3 edge connecting thefirst and third surfaces 1 and 3, a 1-4 edge connecting the first andfourth surfaces 1 and 4, a 2-3 edge connecting the second and thirdsurfaces 2 and 3, and a 2-4 edge connecting the second and fourthsurfaces 2 and 4. The 1-3 edge and the 2-3 edge have a form contractedtoward the center of the body in the first direction as they approachthe third surface 3, and the 1-4 edge and the 2-4 edge may have a formcontracted toward the center of the body in the first direction as theyapproach the fourth surface 4.

As a margin region in which the internal electrodes 121 and 122 are notdisposed is overlapped on the dielectric layer 111, a step differenceoccurs due to the thickness of the internal electrodes 121 and 122, andan edge connecting the first surface and the third to fifth surfacesand/or an edge connecting the second surface and the third to the fifthsurfaces may have a shape that is contracted toward the center of thebody 110 in the first direction, when viewed from the first surface orthe second surface. Alternatively, due to the shrinkage behavior in thesintering process of the body, an edge connecting the first surface 1and the third to sixth surfaces 3, 4, 5, and 6 and/or an edge connectingthe second surface 2 and the third to sixth surfaces 3, 4, 5 and 6 mayhave a shape that is contracted toward the center of the body 110 in thefirst direction when viewed from the first surface or the secondsurface. Alternatively, to prevent chipping defects and the like, as theedges connecting respective surfaces of the body 110 are rounded byperforming a separate process, the edge connecting the first surface andthe third to sixth surfaces and/or the edge connecting the secondsurface and the third to sixth surfaces may have a rounded shape.

The edge may include the 1-3 edge connecting the first surface 1 and thethird surface 3, the 1-4 edge connecting the first surface 1 and thefourth surface 4, the 2-3 edge connecting the second surface 2 and thethird surface 3, and the 2-4 edge connecting the second and fourthsurfaces 2 and 4. Also, the edge may include a 1-5 edge connecting thefirst surface 1 and the fifth surface 5, a 1-6 edge connecting the firstsurface 1 and the sixth surface 6, a 2-5 edge connecting the secondsurface 2 and the fifth surface 5, and a 2-6 edge connecting the secondsurface 2 and the sixth surface 6. The first to sixth surfaces 1 to 6 ofthe body 110 may be substantially flat surfaces, and non-flat regionsmay be regarded as edges. Hereinafter, the extension line of eachsurface may indicate a line extended based on a flat portion of eachsurface.

In this case, in the external electrodes 131 and 132, a region disposedon an edge of the body 110 may be referred to as an edge portion, aregion disposed on the third and fourth surfaces of the body 110 may bereferred to as a connection portion, and a region disposed on the firstand second surfaces of the body may be referred to as a band portion.

On the other hand, to suppress the step difference caused by theinternal electrodes 121 and 122, in case in which cutting is performedso that the internal electrodes are exposed to the fifth and sixthsurfaces 5 and 6 of the body after lamination, and then, in the case offorming margin portions 114 and 115 by stacking a single dielectriclayer or two or more dielectric layers on both sides of a capacitanceformation portion Ac in the third direction (width direction), a portionconnecting the first surface 1 and the fifth and sixth surfaces 5 and 6and a portion connecting the second surface 2 and the fifth and sixthsurfaces 5 and 6 may not have a contracted shape.

The plurality of dielectric layers 111 forming the body 110 are in afired state, and the boundary between the adjacent dielectric layers 111may be integrated to the extent that it is difficult to check withoutusing a scanning electron microscope (SEM).

According to an embodiment, the raw material for forming the dielectriclayer 111 is not particularly limited as long as sufficient capacitancemay be obtained. For example, a barium titanate-based material, a leadcomposite perovskite-based material, or a strontium titanate-basedmaterial may be used. The barium titanate-based material may includeBaTiO₃-based ceramic powder. As an example of the ceramic powder,BaTiO₃, (Ba_(1-x)Ca_(x)) TiO₃ (0<x<1), Ba(Ti_(1-y)Ca_(y)) O₃ (0<y<1),(Ba_(1-x)Ca_(x)) (Ti_(1-y)Zr_(y)) O₃ (0<x<1, 0<y<1) orBa(Ti_(1-y)Zr_(y)) O₃ (0<y<1) in which Ca (calcium), zirconium (Zr) orthe like is partially solid-solubilized in BaTiO₃, or the like may beused.

In addition, as a raw material for forming the dielectric layer 111,according to the usage of the present disclosure, various ceramicadditives, organic solvents, binders, dispersants, and the like may beadded to the powder such as barium titanate (BaTiO₃).

On the other hand, an average thickness td of the dielectric layer 111does not need to be particularly limited.

However, in general, in the case in which the dielectric layer is formedthinly with a thickness of less than 0.6 μm, in detail, the thickness ofthe dielectric layer is 0.35 μm or less, there is a concern that thereliability may be lowered.

According to an embodiment of the present disclosure, by disposing aninsulating layer on the connection portion of the external electrode,and disposing the plating layer on the band portion of the externalelectrode, reliability may be improved by preventing penetration ofexternal moisture, a plating solution, and the like. Therefore, evenwhen the average thickness of the dielectric layer 111 is 0.35 μm orless, excellent reliability may be secured.

Therefore, when the average thickness of the dielectric layer 111 is0.35 μm or less, the reliability improvement effect according to anembodiment of the present disclosure may be more significant.

The average thickness td of the dielectric layer 111 may indicate anaverage thickness of the dielectric layer 111 disposed between the firstand second internal electrodes 121 and 122.

The average thickness of the dielectric layer 111 may be measured byscanning an image of the length and thickness direction (L-T)cross-section of the body 110 with a scanning electron microscope (SEM)having a magnification of 10,000. In detail, the average value may bemeasured by measuring the thickness of one dielectric layer at 30equally spaced points in the length direction in the scanned image. The30 points at equal intervals may be designated in the capacitanceformation portion Ac. In addition, by expanding this average measurementto 10 dielectric layers and measuring the average value, the averagethickness of the dielectric layers may be more generalized.

The body 110 may include the capacitance formation portion Ac thatincludes the first internal electrode 121 and the second internalelectrode 122 disposed to face each other with the dielectric layer 111interposed therebetween, to form capacitance, and cover portions 112 and113 formed on upper and lower portions of the capacitance formationportion Ac in the first direction. The capacitance formation portion Acand the cover portions 112 and 113 are disposed inside the body 110.

In addition, the capacitance formation portion (Ac) may be a part thatcontributes to the capacitance formation of the capacitor, and may beformed by repeatedly stacking the plurality of first and second internalelectrodes 121 and 122 with the dielectric layer 111 interposedtherebetween.

The cover portions 112 and 113 may include an upper cover portion 112disposed on the capacitance formation portion Ac in the first direction,and a lower cover portion 113 disposed below the capacitance formationportion Ac in the first direction.

The upper cover portion 112 and the lower cover portion 113 may beformed by stacking a single dielectric layer or two or more dielectriclayers on the upper and lower surfaces of the capacitance formationportion Ac in the thickness direction, respectively, and may basicallyserve to prevent damage to the internal electrode due to physical orchemical stress.

The upper cover portion 112 and the lower cover portion 113 do notinclude an internal electrode and may include the same material as thedielectric layer 111.

For example, the upper cover portion 112 and the lower cover portion 113may include a ceramic material, for example, include a barium titanate(BaTiO₃)-based ceramic material.

On the other hand, the average thickness of the cover portions 112 and113 does not need to be particularly limited. However, to more easilyobtain miniaturization and high capacitance of the multilayer electroniccomponent, an average thickness tc of the cover portions 112 and 113 maybe 15 μm or less. Further, according to an embodiment, by disposing theinsulating layer on the connection portion of the external electrode anddisposing the plating layer on the band portion of the externalelectrode, reliability may be improved by preventing penetration ofexternal moisture and a plating solution. Therefore, even when theaverage thickness tc of the cover portions 112 and 113 is 15 μm or less,excellent reliability may be secured.

The average thickness tc of the cover portions 112 and 113 may indicatea size in the first direction, and may be a value obtained by averagingthe sizes of the cover portions 112 and 113 in the first directionmeasured at five points spaced apart at equal intervals on the upper orlower portion of the capacitance formation portion Ac.

In addition, margin portions 114 and 115 may be disposed on a sidesurface of the capacitance formation portion Ac.

The margin portions 114 and 115 may include a first margin 114 disposedon the fifth surface 5 of the body 110 and a second margin 115 disposedon the sixth surface 6 of the body 110. For example, the margin portions114 and 115 may be disposed on both end surfaces of the body 110 in thewidth direction.

As illustrated in FIG. 3 , the margin portions 114 and 115 may refer toregions between both ends of the first and second internal electrodes121 and 122 and the boundary surface of the body 110 in thecross-section of the body 110 in the width-thickness (W-T) direction.

The margin portions 114 and 115 may basically serve to prevent damage tothe internal electrode due to physical or chemical stress.

The margin portions 114 and 115 may be formed by forming internalelectrodes by applying a conductive paste on the ceramic green sheetexcept where the margin portion is to be formed.

In addition, to suppress the step difference due to the internalelectrodes 121 and 122, after cutting so that the internal electrode isexposed to the fifth and sixth surfaces 5 and 6 of the body afterlamination, by laminating a single dielectric layer or two or moredielectric layers on both sides of the capacitance formation portion Acin the third direction (width direction), the margin portions 114 and115 may be formed.

On the other hand, the widths of the margin portions 114 and 115 do notneed to be particularly limited. However, to more easily obtainminiaturization and high capacitance of the multilayer electroniccomponent, the average width of the margin portions 114 and 115 may be15 μm or less. In addition, according to an embodiment, an insulatinglayer is disposed on the connection portion of the external electrode,and the plating layer is disposed on the band portion of the externalelectrode, thereby improving reliability by preventing penetration ofexternal moisture, a plating solution, and the like. Therefore, evenwhen the average width of the margin portions 114 and 115 is 15 μm orless, excellent reliability may be secured.

The average width of the margin portions 114 and 115 may indicate anaverage size of the margin portions 114 and 115 in the third direction,and may be a value obtained by averaging the sizes of the marginportions 114 and 115 in the third direction, measured at five equallyspaced points on the side surface of the capacitance formation portionAc.

The internal electrodes 121 and 122 may be alternately stacked with thedielectric layer 111.

The internal electrodes 121 and 122 may include first and secondinternal electrodes 121 and 122. The first and second internalelectrodes 121 and 122 are alternately disposed to face each other withthe dielectric layer 111 constituting the body 110 and interposedtherebetween, and the first and second internal electrodes 121 and 122may be exposed to the third and fourth surfaces 3 and 4 of the body 110,respectively.

Referring to FIG. 3 , the first internal electrode 121 may be spacedapart from the fourth surface 4 and exposed through the third surface 3,and the second internal electrode 122 may be spaced apart from the thirdsurface 3 and be exposed through the fourth surface 4. The firstexternal electrode 131 is disposed on the third surface 3 of the bodyand is connected to the first internal electrode 121, and a secondexternal electrode 132 may be disposed on the fourth surface 4 of thebody to be connected to the second internal electrode 122.

For example, the first internal electrode 121 is not connected to thesecond external electrode 132, but is connected to the first externalelectrode 131, and the second internal electrode 122 is not connected tothe first external electrode 131, but is connected to the secondexternal electrode 132. Accordingly, the first internal electrode 121 isformed to be spaced apart from the fourth surface 4 by a predetermineddistance, and the second internal electrode 122 may be formed to bespaced apart from the third surface 3 by a predetermined distance.

In this case, the first and second internal electrodes 121 and 122 maybe electrically separated from each other by the dielectric layer 111disposed therebetween.

The body 110 may be formed by alternately stacking a ceramic green sheeton which the first internal electrode 121 is printed and a ceramic greensheet on which the second internal electrode 122 is printed, followed byfiring.

The material for forming the internal electrodes 121 and 122 is notparticularly limited, and a material having excellent electricalconductivity may be used. For example, the internal electrodes 121 and122 may include at least one of nickel (Ni), copper (Cu), palladium(Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W),titanium (Ti), and alloys thereof.

In addition, the internal electrodes 121 and 122 may be formed byprinting the conductive paste for internal electrodes, containing atleast one of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold(Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloysthereof, on a ceramic green sheet. The printing method of the conductivepaste for the internal electrode may use a screen printing method, agravure printing method, or the like, but the present disclosure is notlimited thereto.

On the other hand, the average thickness te of the internal electrodes121 and 122 does not need to be particularly limited.

However, in general, in the case in which the internal electrode isformed thinly with a thickness of less than 0.6 μm, in detail, thethickness of the internal electrode is 0.35 μm or less, there is aconcern that the reliability may be lowered.

According to an embodiment of the present disclosure, an insulatinglayer is disposed on the connection portion of the external electrode,and a plating layer is disposed on the band portion of the externalelectrode. Therefore, reliability may be improved by preventingpenetration of external moisture, a plating solution, and the like.Thus, even when the average thickness of the internal electrodes 121 and122 is 0.35 μm or less, excellent reliability may be secured.

Therefore, when the average thickness of the internal electrodes 121 and122 is 0.35 μm or less, the effect according to the present disclosuremay be more significant, and miniaturization and high capacitance of themultilayer electronic component may be more easily obtained.

The average thickness te of the internal electrodes 121 and 122 mayindicate an average thickness of the internal electrodes 121 and 122.

The average thickness of the internal electrodes 121 and 122 may bemeasured by scanning an image of the length and thickness direction(L-T) cross-section of the body 110 with a scanning electron microscope(SEM) with a magnification of 10,000. In detail, the average value maybe measured by measuring the thickness of one internal electrode at 30equal intervals in the length direction in the scanned image. The 30points spaced apart at equal intervals may be designated in thecapacitance formation portion Ac. In addition, when the average value ismeasured by expanding this average value measurement to 10 internalelectrodes, the average thickness of the internal electrode may befurther generalized.

The external electrodes 131 and 132 may be disposed on the third surface3 and the fourth surface 4 of the body 110. The external electrodes 131and 132 may include first and second external electrodes 131 and 132respectively disposed on the third and fourth surfaces 3 and 4 of thebody 110 and connected to the first and second internal electrodes 121and 122, respectively.

The external electrodes 131 and 132 may include a first externalelectrode 131 including a first connection portion 131 a disposed on thethird surface 3 and a first band portion 131 b extending from the firstconnection portion 131 a onto a portion of the first surface 1, and asecond external electrode 132 including a second connection portion 132a disposed on the fourth surface 4 and a second band portion 132 bextending from the second connection portion 132 a onto a portion of thefirst surface 1. The first connection portion 131 a may be connected tothe first internal electrode 121 on the third surface 3, and the secondconnection portion 132 a may be connected to the second internalelectrode 122 on the fourth surface 4.

In addition, the first external electrode 131 may include a third bandportion 131 c extending from the first connection portion 131 a onto aportion of the second surface, and the second external electrode 132 mayinclude a fourth band portion 132 c extending from the second connectionportion 132 a onto a portion of the second surface. Furthermore, thefirst external electrode 131 may include a side band portion extendingfrom the first connection portion 131 a onto portions of the fifth andsixth surfaces, and the second external electrode 132 may include a sideband portion extending from the second connection portion 132 a ontoportions of the fifth and sixth surfaces.

The first and second external electrodes 131 and 132 may not be disposedon the second surface 2 or may not be disposed on the fifth and sixthsurfaces 5 and 6. As the first and second external electrodes 131 and132 are not disposed on the second surface 2, the first and secondexternal electrodes 131 and 132 may be disposed below an extension lineof the second surface 2 of the body. In addition, the first and secondconnection portions 131 a and 132 a may be disposed to be spaced apartfrom the fifth and sixth surfaces 5 and 6, and the first and secondconnection portions 131 a and 132 a may be disposed to be spaced apartfrom the second surface 2. In addition, the first and second bandportions 131 b and 132 b may also be disposed to be spaced apart fromthe fifth and sixth surfaces 5 and 6.

On the other hand, when the first and second external electrodes 131 and132 include third and fourth band portions 131 c and 132 c, although theinsulating layer is illustrated as being disposed on the third andfourth band portions 131 c and 132 c, the present disclosure is notlimited thereto. To improve mounting convenience, a plating layer may bedisposed on the third and fourth band portions 131 c and 132 c. Inaddition, the first and second external electrodes 131 and 132 mayinclude the third and fourth band portions 131 c and 132 c, but may notinclude the side band portions, and in this case, the first and secondconnection portions 131 a and 132 a, and the first to fourth bandportions 131 a, 132 b, 131 c, and 132 c may have a form spaced apartfrom the fifth and sixth surfaces 5 and 6.

In this embodiment, the structure in which the multilayer electroniccomponent 1000 has two external electrodes 131 and 132 is described, butthe number or shape of the external electrodes 131 and 132 may bechanged according to the shape of the internal electrodes 121 and 122 orother uses.

On the other hand, the external electrodes 131 and 132 may be formed ofany material as long as they have electrical conductivity, such asmetal. A detailed material may be determined in consideration ofelectrical characteristics, structural stability, and the like, andfurther, the external electrodes 131 and 132 may have a multilayerstructure.

The external electrodes 131 and 132 may be firing electrodes including aconductive metal and glass, or resin-based electrodes including aconductive metal and a resin.

In addition, the external electrodes 131 and 132 may have a shape inwhich a fired electrode and a resin-based electrode are sequentiallyformed on a body. In addition, the external electrodes 131 and 132 areformed by transferring a sheet including a conductive metal on the body,or may be formed by transferring a sheet including a conductive metalonto the firing electrode.

As the conductive metal included in the external electrodes 131 and 132,a material having excellent electrical conductivity may be used, but isnot particularly limited. For example, the conductive metal may be atleast one of Cu, Ni, Pd, Ag, Sn, Cr, and alloys thereof. In detail, theexternal electrodes 131 and 132 may include at least one of Ni and a Nialloy, and accordingly, connectivity with the internal electrodes 121and 122 including Ni may be further improved.

The insulating layer 151 may be disposed on the first and secondconnection portions 131 a and 132 a.

The first and second connection portions 131 a and 132 a are portionsconnected to the internal electrodes 121 and 122, in the platingprocess, and may thus be the path of penetration of the plating solutionor moisture penetration during actual use. Therefore, in an embodimentof the present disclosure, since the insulating layer 151 is disposed onthe connection portions 131 a and 132 a, penetration of externalmoisture or a plating solution may be prevented.

The insulating layer 151 may be disposed to contact the first and secondplating layers 141 and 142. In this case, the insulating layer 151 maybe formed in the form partially covering the ends of the first andsecond plating layers 141 and 142 while being in contact therewith, orthe first and second plating layers 141 and 142 may be formed in theform partially covering the ends of the insulating layer 151 while beingin contact therewith.

The insulating layer 151 may be disposed on the first and secondconnection portions 131 a and 132 a and may be disposed to cover thesecond surface 2 and the third and fourth band portions 131 c and 132 c.In this case, the insulating layer 151 may be disposed to cover a regionin which the third and fourth band portions 131 c and 132 c are notdisposed on the second surface 2, for example, cover the third andfourth band portions 131 c and 132 c. Accordingly, the insulating layer151 covers the region in which the ends of the third and fourth bandportions 131 c and 132 c and the body 110 come into contact, to blockthe moisture penetration path, thereby improving moisture-resistancereliability.

The insulating layer 151 may be disposed on the second surface to extendto the first and second connection portions 131 a and 132 a. Also, whenthe external electrodes 131 and 132 are not disposed on the secondsurface, the insulating layer 151 may be disposed to completely coverthe second surface 2. On the other hand, the insulating layer 151 is notnecessarily disposed on the second surface 2, and the insulating layer151 may not be disposed on some or the entirety of the second surface 2,and the insulating layer 151 may be separated into two and disposed onthe first and second connection portions 131 a and 132 a, respectively.When the insulating layer 151 is not disposed on the entirety of thesecond surface 2, the insulating layer 151 may be disposed below anextension line of the second surface 2. In addition, although theinsulating layer 151 is not disposed on the second surface 2, theinsulating layer 151 may extend from the first and second connectionportions 131 a and 132 a to the fifth and sixth surfaces 5 and 6 to formone insulating layer.

Furthermore, the insulating layer 151 may be disposed to cover portionsof the first and second side band portions, the fifth surface 5, and thesixth surface 6. In this case, portions of the fifth and sixth surfacesthat are not covered by the insulating layer 151 may be exposedexternally.

In addition, the insulating layer 151 may be disposed to cover theentirety of the first and second side band portions, the fifth surface 5and the sixth surface 6, and in this case, since the fifth and sixthsurfaces 5 and 6 are not exposed externally, the moisture resistancereliability may be improved, and the connection portions 131 a and 132 aare also not directly exposed externally, so that the reliability of themultilayer electronic component 1000 may be improved. In detail, theinsulating layer 151 may cover both the first and second side bandportions, and cover all areas of the fifth and sixth surfaces 5 and 6except for the area in which the first and second side band portions areformed.

The insulating layer 151 may serve to prevent the plating layers 141 and142 from being formed on the external electrodes 131 and 132 on whichthe insulating layer 151 is disposed, and may play a role insignificantly reducing penetration of moisture or plating solution fromthe outside by improving the sealing characteristics.

The insulating layer 151 may include an oxide containing Ba.

In the related art, a glass-based material is generally used for theinsulating layer, but due to the nature of the glass-based material, itis difficult to form a uniform film due to severe agglomeration duringsintering. Because heat is required during the sintering process, stressmay occur in the body and cracks or delaminations may be caused. Inaddition, when an insulating layer including a glass-based material isused, a method of firing an insulating layer including a glass-basedmaterial after firing the external electrode is used, but in the processof firing the insulating layer, the metal material of the externalelectrode may diffuse into the internal electrode, which may causeradiation cracks. Furthermore, since the glass-based material generallyhas a hard characteristic, there is a concern that the glass-basedmaterial may be broken even by a small impact.

In the present disclosure, by applying an oxide containing Ba instead ofa glass-based material to the insulating layer, an attempt is made toprevent the problem of the glass-based insulating layer. The oxidecontaining Ba not only has insulating properties, but also has excellentimpact resistance compared to the glass-based oxide. In addition, sincethe oxide containing Ba has the property of a desiccant to adsorbmoisture and gas, by adsorbing moisture and gas flowing in from theoutside, the insulating layer may serve to block penetration of moistureand gas into the first and second connection portions 131 a and 132 aand the body 110. Furthermore, when moisture and gas penetrate into thefirst and second connection portions 131 a and 132 a and the body 110through other paths, the insulating layer may serve to induce moistureand gas to escape externally again.

Therefore, by applying an oxide containing Ba instead of glass-based inthe insulating layer, the moisture resistance reliability may be furtherimproved, and cracks due to heat shrinkage and radiation cracks due tometal diffusion may be suppressed.

The method of forming the insulating layer 151 does not need to beparticularly limited.

For example, after the external electrodes 131 and 132 may be formed onthe body 110, an insulating layer 151 including an oxide containing Bais formed using an atomic layer deposition (ALD). For example, theinsulating layer 151 may be formed by an atomic layer deposition method,and accordingly, a thin and uniform insulating layer 151 may be formed.The precursor used to form the insulating layer by the atomic layerdeposition method may be selected from Ba(C₅H₇O₂)₂, Ba(C₁₁H₁₉O₂)₂,Ba(C₅HF₆O₂)₂, Ba(C₁₀H₁₀F₇O₂)₂ Sr(C₁₀H₁₀F₇O₂)₂, Ba(C₁₁H₁₉O₂)—CH₃(OCH₂CH₂)₄OCH₃ and combinations thereof, but the present disclosure maynot be limited to thereto. In addition, the atomic layer depositionmethod may be performed in a temperature range of about 60° C. to about200° C., but may not be limited thereto.

The type of oxide containing Ba included in the insulating layer 151 isnot particularly limited, but may be, for example, BaO.

In an embodiment, in the insulating layer 151, the number of moles of Baatoms relative to the total number of moles of elements other thanoxygen atoms may be 0.95 or more. For example, except for elementsdetected as impurities, the insulating layer 151 may be substantiallyformed of an oxide containing Ba. In this case, the oxide containing Bamay be BaO. Accordingly, the effect of suppressing cracks due to heatshrinkage, radiation cracks caused by metal diffusion, and the like andthe effect of improving moisture resistance reliability may be furtherimproved.

In this case, the component of the insulating layer 151 may becalculated from an image observed using Scanning ElectronMicroscope-Energy Dispersive X-ray Spectroscopy (SEM-EDS). In detail,after exposing the length and thickness direction cross-sections (L-Tcross-section) by grinding the multilayer electronic component to thecentral position in the width direction (third direction), the number ofmoles of respective elements included in the insulating layer may bemeasured using EDS in the central region among regions in which theinsulating layer is divided into 5 equal parts in the thicknessdirection, and the number of moles of Ba atoms relative to the totalnumber of moles of elements other than oxygen atoms may be calculated.

In an embodiment, an average thickness t2 of the insulating layer 151may be 50 nm or more and 3 μm or less. When the average thickness t2 ofthe insulating layer 151 is 50 nm or more, the moisture transmittance ofthe insulating layer 151 may be Omg/[m² day], and thereby, moistureresistance reliability may be improved.

If the average thickness of the insulating layer 151 is less than 50 nm,there is a concern that the effect of suppressing cracks due to heatshrinkage and radiation cracking due to metal diffusion and the effectof improving moisture resistance reliability may not be sufficientlysecured. The moisture permeability of the insulating layer may exceed 0mg/[m² day]. On the other hand, if the average thickness of theinsulating layer 151 is greater than 3 μm, insulation layer formationtime may be too long, and as the overall size of the multilayerelectronic component increases, the capacitance per unit volume maydecrease.

The average thickness t2 of the insulating layer 151 may be an averageof thicknesses measured at five points at equal intervals on the firstand second connection portions 131 a and 132 a. As a more detailedexample, the average thickness t2 may be a value obtained by averagingthe thickness values of the insulating layer measured at a central pointof the first and second connection portions 131 a and 132 a in the firstdirection, two points spaced apart by 5 μm in the first direction withrespect to the central point in the first direction, and two pointsspaced apart by 10 μm in the first direction.

In an embodiment, a cover layer disposed on the insulating layer 151 andincluding an insulating material may be further included. In this case,the insulating material included in the cover layer does not need to beparticularly limited, and the cover layer may include an insulatingmaterial to have an electrically insulating property. A more detaileddescription will be given later.

In an embodiment, the insulating layer 151 is disposed to be in directcontact with the first and second external electrodes 131 and 132, andthe first and second external electrodes 131 and 132 may includeconductive metal and glass. Accordingly, since the plating layers 141and 142 may not be disposed in the region in which the insulating layer151 is disposed among the external surfaces of the first and secondexternal electrodes 131 and 132, external electrode erosion by theplating solution may be effectively prevented.

In this case, the first plating layer 141 may be disposed to cover theend of the insulating layer 151 disposed on the first external electrode131, and the second plating layer 142 may be disposed to cover an end ofthe insulating layer 151 disposed on the second external electrode 132.By first forming the insulating layer 151 before forming the platinglayers 141 and 142 on the external electrodes 131 and 132, penetrationof the plating solution in the process of forming the plating layer maybe more reliably suppressed. As the insulating layer is formed beforethe plating layer, the plating layers 141 and 142 may have a shapecovering the ends of the insulating layer 151.

The first and second plating layers 141 and 142 may be disposed on thefirst and second band portions 131 b and 132 b, respectively. Theplating layers 141 and 142 may serve to improve the mountingcharacteristics, and as the plating layers 141 and 142 are disposed onthe band portions 131 b and 132 b, the mounting space may besignificantly reduced, and reliability may be improved by significantlyreducing penetration of the plating solution into the internalelectrode. One end of the first and second plating layers 141 and 142may contact the first surface, and the other end may contact theinsulating layer 151.

The type of the plating layers 141 and 142 is not particularly limited,and may be a plating layer including at least one of Cu, Ni, Sn, Ag, Au,Pd and alloys thereof, and the plating layers may be formed in aplurality of layers.

For a more detailed example of the plating layer (141, 142), the platinglayers 141 and 142 may be a Ni plating layer or a Sn plating layer, andthe Ni plating layer and the Sn plating layer may be sequentially formedon the first and second band portions 131 b and 132 b.

In an embodiment, the first and second plating layers 141 and 142 may beextended to partially cover the first and second connection portions 131a and 132 a, respectively. Among the first and second internalelectrodes 121 and 122, when the average size in the first direction upto the internal electrode disposed closest to the first surface 1 isreferred to as H1 and the average size in the first direction from theextension line of the first surface 1 to the ends of the first andsecond plating layers 141 and 142 disposed on the first and secondconnection portions 131 a and 132 a is referred to as H2, H1>H2 (orH1≥H2) may be satisfied. Accordingly, the penetration of the platingsolution into the internal electrode during the plating process may besuppressed, thereby improving reliability.

H1 and H2 may be values obtained by averaging values measured at across-section (L-T cross-section) obtained by cutting the body 110 inthe first and second directions at five points having equal intervalstherebetween in the third direction. H1 may be an average value ofvalues measured at a point where the internal electrode disposed closestto the first surface 1 in each cross-section is connected to theexternal electrode, and H2 may be an average value of values measuredbased on the tip of the plating layer in contact with the externalelectrode, and in measuring H1 and H2, the extension line E1 of thefirst surface 1 serving as a reference may be the same.

In an embodiment, the first plating layer 141 may be disposed to coverthe end of the insulating layer 151 disposed on the first externalelectrode 131, and the second plating layer 142 may be disposed to coveran end of the insulating layer 151 disposed on the second externalelectrode 132. Accordingly, the reliability of the multilayer electroniccomponent 1000 may be improved by strengthening the bonding forcebetween the insulating layer 151 and the plating layers 141 and 142.

In an embodiment, the insulating layer 151 may be disposed to cover theend of the first plating layer 141 disposed on the first externalelectrode 131, and the insulating layer 151 may be disposed to cover anend of the second plating layer 142 disposed on the second externalelectrode 132. Accordingly, the reliability of the multilayer electroniccomponent 1000 may be improved by strengthening the bonding forcebetween the insulating layer 151 and the plating layers 141 and 142.

In an embodiment, when the second direction average size of the body 110is L, the second direction average size from the extension line of thethird surface to the end of the first band portion is B1, and theaverage size in the second direction from the extension line of thefourth surface to the end of the second band portion is B2, 0.2≤B1/L≤0.4and 0.2≤B2/L≤0.4 may be satisfied.

If B1/L and B2/L are less than 0.2, it may be difficult to securesufficient fixing strength. On the other hand, if B2/L is greater than0.4, there is a risk that a leakage current may be generated between thefirst band portion 131 b and the second band portion 132 b under a highvoltage current, and during the plating process, there is a concern thatthe first band portion 131 b and the second band portion 132 b may beelectrically connected to each other due to plating spread.

B1, B2 and L may be the average value of the values measured in thesection (L-T section) cut in the first and second directions at fivepoints having equal intervals therebetween in the third direction of thebody 110.

Referring to FIG. 5 illustrating a mounting board 1100 on which themultilayer electronic component 1000 is mounted, the plating layers 141and 142 of the multilayer electronic component 1000 may be bonded to theelectrode pads 181 and 182 disposed on a substrate 180 by solders 191and 192.

On the other hand, when the internal electrodes 121 and 122 are stackedin the first direction, the multilayer electronic component 1000 may behorizontally mounted on the substrate 180 such that the internalelectrodes 121 and 122 are parallel to the mounting surface. However,the present disclosure is not limited to the case of horizontalmounting, and when the internal electrodes 121 and 122 are stacked inthe third direction, the multilayer electronic component may bevertically mounted on the substrate so that the internal electrodes 121and 122 are perpendicular to the mounting surface.

The size of the multilayer electronic component 1000 does not need to beparticularly limited.

However, to obtain miniaturization and high capacitance simultaneously,since the thickness of the dielectric layer and the internal electrodeshould be thinned to increase the number of layers, in the multilayerelectronic component 1000 having a size of 1005 (length×width, 1.0mm×0.5 mm) or less, the effect of improving reliability and capacitanceper unit volume according to an embodiment of the present disclosure maybecome more significant.

Therefore, considering manufacturing errors and external electrodesizes, when the length of the multilayer electronic component 1000 is1.1 mm or less and the width is 0.55 mm or less, the reliabilityimprovement effect according to the present disclosure may be moresignificant. In this case, the length of the multilayer electroniccomponent 1000 means a maximum size of the multilayer electroniccomponent 1000 in the second direction, and the width of the multilayerelectronic component 1000 may indicate a maximum size of the multilayerelectronic component 1000 in the third direction.

FIG. 6 schematically illustrates a multilayer electronic component 1001according to an embodiment, and FIG. 7 is a cross-sectional view takenalong line II-II′ of FIG. 6 .

Referring to FIGS. 6 and 7 , in the multilayer electronic component 1001according to an embodiment, first and second plating layers 141-1 and142-1 may be disposed on a level the same as or below an extension lineE1 of the first surface 1. Accordingly, the height of the solder may besignificantly reduced during mounting, and the mounting space may besignificantly reduced.

In addition, an insulating layer 151-1 may extend below the extensionline E1 of the first surface 1 and may be disposed to contact the firstand second plating layers 141-1 and 142-1.

FIG. 8 is a schematic perspective view of a multilayer electroniccomponent 1002 according to an embodiment, and FIG. 9 is across-sectional view taken along line III-III′ of FIG. 8 .

Referring to FIGS. 8 and 9 , the multilayer electronic component 1002according to an embodiment may further include an additional insulatinglayer 161 disposed on the first surface 1 and disposed between the firstband portion 131 b and the second band portion 132 b. Accordingly,leakage current that may occur between the first band portion 131 b andthe second band portion 132 b under a high-voltage current may beprevented.

The type of the additional insulating layer 161 does not need to beparticularly limited. For example, the additional insulating layer 161may include an oxide containing Ba like the insulating layer 151, andmay include BaO, and may be BaO. However, it is not necessary to limitthe additional insulating layer 161 and the insulating layer 151 to thesame material, and may be formed of different materials. For example,the insulating layer 161 may include at least one selected from epoxyresin, acrylic resin, ethyl cellulose, and the like, or may includeglass.

FIG. 10 is a schematic perspective view of a multilayer electroniccomponent 1003 according to an embodiment, and FIG. 11 is across-sectional view taken along line IV-IV′ of FIG. 10 .

Referring to FIGS. 10 and 11 , in the multilayer electronic component1003 according to an embodiment, when H1 is the average size in thefirst direction from the first surface 1 to the internal electrodedisposed closest to the first surface 1 among the first and secondinternal electrodes 121 and 122, and when the average size in the firstdirection from the extension line of the first surface 1 to the ends ofthe plating layers 141-3 and 142-3 disposed on the first and secondconnection portions 131 a and 132 a is H2, H1<H2 may be satisfied.Accordingly, by increasing the area in contact with the solder duringmounting, the fixing strength may be improved.

In detail, when the average size of the body 110 in the first directionis T, H2<T/2 may be satisfied. For example, H1<H2<T/2 may be satisfied.If H2 is T/2 or more, there is a possibility that the effect ofimproving moisture-resistance reliability by the insulating layer maydeteriorate.

H1, H2, and T may be values obtained by averaging values measured incross sections (L-T cross-sections) obtained by cutting the body 110 inthe first and second directions at five points having equal intervalstherebetween in the third direction. H1 may be an average value ofvalues measured at a point where the internal electrode disposed closestto the first surface 1 in each cross-section is connected to theexternal electrode, and H2 may be an average value of values measuredbased on the tip of the plating layer in contact with the externalelectrode in each section, and in measuring H1 and H2, the extensionline E1 of the first surface 1 serving as a reference may be the same.In addition, T may be an average value after measuring a maximum size ofthe body 110 in the first direction in each cross-section.

FIG. 12 is a schematic perspective view of a multilayer electroniccomponent 1004 according to an embodiment, and FIG. 13 is across-sectional view taken along line V-V′ of FIG. 12 .

Referring to FIGS. 12 and 13 , in the multilayer electronic component1004 according to an embodiment, an average length B1 of a first bandportion 131 b-4 may be longer than an average length B3 of a third bandportion 131 c-4, and the average length of a second band portion 132 b-4may be longer than an average length B4 of a fourth band portion 132c-4. Accordingly, by increasing the area in contact with the solderduring mounting, the fixing strength may be improved.

In more detail, when the average size in the second direction from theextension line E3 of the third surface 3 to the end of the first bandportion 131 b-4 is B1, the average size of the second direction from theextension line E4 of the fourth surface 4 to the end of the second bandportion 132 b-4 is B2, the average size in the second direction from theE3 extension line of the third surface 3 to the end of the third bandportion 131 c-4 is B3, and the average size in the second direction fromthe extension line E4 of the fourth surface 4 to the end of the fourthband portion 132 c-4 is B4, B3<B1 and B4<B2 may be satisfied.

In this case, when the average size of the body 110 in the seconddirection is L, 0.2≤B1/L≤0.4 and 0.2≤B2/L≤0.4 may be satisfied.

B1, B2, B3, B4 and L may be a value obtained by averaging valuesmeasured in a cross section (L-T cross-section) cut in the first andsecond directions at five points having equal intervals therebetween inthe third direction.

In addition, a first external electrode 131-4 may include a first sideband portion extending from the first connection portion 131 a-4 ontoportions of the fifth and sixth surfaces 5 and 6, and a second externalelectrode 132-4 may include a second side band portion extending fromthe second connection portion 132 a-4 onto portions of the fifth andsixth surfaces 5 and 6. In this case, the sizes of the first and secondside band portions in the second direction may gradually increase asthey approach the first surface. For example, the first and second sideband portions may be disposed in a tapered shape or a trapezoidal shape.

Further, when the average size in the second direction from theextension line E3 of the third surface 3 to the end of the third bandportion 141 c-4 is B3, the average size of the second direction from theextension line E4 of the fourth surface 4 to the end of the fourth bandportion 142 c-4 is B4, the second direction average size of the regionin which the third surface 3 and the second internal electrode 122 arespaced apart is G1, and the average size in the second direction of theregion in which the fourth surface 4 and the first internal electrode121 are spaced apart is G2, B3 G1 and B4 G2 may be satisfied.Accordingly, the capacitance of the multilayer electronic component 1004per unit volume may be increased by significantly reducing the volumeoccupied by the external electrode.

In the G1 and G2 in cross-sections obtained by cutting the body in thefirst and second directions from the center in the third direction, avalue obtained by averaging the sizes in the second direction spacedapart from the third surface measured for five second internalelectrodes located in the central portion in the first direction may bedefined as G1, and a value obtained by averaging the sizes of theregions spaced apart from the fourth surface measured with respect tofive arbitrary first internal electrodes located in the central portionin the first direction may be defined as G2.

Furthermore, the G1 and G2 may be obtained on the cross section (L-Tcross-section) cut in the first and second directions at five pointshaving equal intervals therebetween in the third direction, and may thenbe averaged to be more generalized.

However, it is not intended to limit the present disclosure to B3≤G1 andB4≤G, and even when B3≥G1 and B4≥G2 are satisfied, this may be includedas an embodiment of the present disclosure. Thus, in an embodiment, whenthe average size in the second direction from the extension line E3 ofthe third surface 3 to the end of the third band portion is B3, theaverage size in the second direction from the extension line E4 of thefourth surface 3 to the end of the fourth band portion is B4, theaverage size in the second direction of the region in which the thirdsurface and the second internal electrode are spaced apart is G1, andthe average size in the second direction of the region in which thefourth surface and the first internal electrode are spaced apart is G2,B3≤G1 and B4 G2 may be satisfied.

In an embodiment, when the average size in the second direction from theextension line E3 of the third surface 3 to the end of the first bandportion is B1, and the average size in the second direction from theextension line E4 of the fourth surface 4 to the end of the second bandportion is B2, B1≥G1 and B2 G2 may be satisfied.

Accordingly, the bonding strength of the multilayer electronic component1004 to the substrate 180 may be improved.

FIG. 14 is a schematic perspective view of a multilayer electroniccomponent 1005 according to an embodiment, and FIG. 15 is across-sectional view taken along line VI-VI′ of FIG. 14 .

Referring to FIGS. 14 and 15 , first and second external electrodes131-5 and 132-5 of the multilayer electronic component 1005 according toan embodiment are not disposed on the second surface, and may bedisposed on the third, fourth and first surfaces to have an L-shape. Forexample, the first and second external electrodes 131-5 and 132-5 may bedisposed below the extension line of the second surface.

The first external electrode 131-5 may include a first connectionportion 131 a-5 disposed on the third surface 3, and a first bandportion 131 b-5 extending from the first connection portion 131 a-5 ontoa portion of the first surface 1. The second external electrode 132-5may include a second connection portion 132 a-5 disposed on the fourthsurface 4, and a second band portion 132 b-5 extending from the secondconnection portion 132 a-5 to a portion of the first surface 1. Sincethe external electrodes 131-5 and 132-5 are not disposed on the secondsurface 2, an insulating layer 151-5 may be disposed to cover the entiresecond surface 2. Accordingly, the volume occupied by the externalelectrodes 131-5 and 132-5 may be significantly reduced. The capacitanceof the multilayer electronic component 1005 per unit volume may befurther improved. However, it is not necessary to limit the insulatinglayer 151-5 to a form that covers the entirety of the second surface 2,and the insulating layer may have a form in which the insulating layerdoes not cover a portion or the entirety of the second surface 2, but isseparated to cover the first and second connection portions 131 a-5 and132 a-5, respectively.

A first plating layer 141-5 may be disposed on the first band portion131 b-5, a second plating layer 142-5 may be disposed on the second bandportion 132 b-5, and the first and second plating layers 141-5 and 142-5may be disposed to extend onto portions of the first and secondconnection portions 132 a-5 and 132 b-5.

In this case, the external electrodes 131-5 and 132-5 may not bedisposed even on the fifth and sixth surfaces 5 and 6. For example, theexternal electrodes 131-5 and 132-5 may be disposed only on the third,fourth, and first surfaces.

When the average size in the first direction from the first surface 1 upto the internal electrode disposed closest to the first surface 1 amongthe first and second internal electrodes 121 and 122 is H1, and theaverage size in the first direction from the extension line E1 of thefirst surface 1 to the ends of the plating layers 141-5 and 142-5disposed on the first and second connection portions 131 a-5 and 132 a-5is H2, H1<H2 may be satisfied. Accordingly, the fixing strength may beimproved by increasing the area in contact with the solder duringmounting, and by increasing the contact area between the externalelectrodes 131-5 and 132-5 and the plating layers 141-5 and 142-5, anincrease in Equivalent Series Resistance (ESR) may be suppressed.

In detail, when the average size of the body 110 in the first directionis T, H2<T/2 may be satisfied. For example, H1<H2<T/2 may be satisfied.If H2 is T/2 or more, there exists a possibility that themoisture-resistance reliability improvement effect by an insulatinglayer may deteriorate.

Also, the first and second plating layers 141-5 and 142-5 may bedisposed to cover a portion of the insulating layer 151-1 on the thirdand fourth surfaces. For example, the plating layers 141-5 and 142-5 maybe disposed to cover the end of the insulating layer 151-5 on the thirdand fourth surfaces. Accordingly, the bonding force between theinsulating layer 151-5 and the plating layers 141-5 and 142-5 may bestrengthened and the reliability of the multilayer electronic component1005 may be improved.

Also, the insulating layer 151-5 may be disposed to cover portions ofthe first and second plating layers 141-5 and 142-5 on the third andfourth surfaces. For example, the insulating layer 151-5 may be disposedto cover the ends of the plating layers 141-5 and 142-5 on the third andfourth surfaces. Accordingly, the reliability of the multilayerelectronic component 1005 may be improved by strengthening the bondingforce between the insulating layer 151-5 and the plating layers 141-5and 142-5.

FIG. 16 illustrates a modified example of FIG. 14 . Referring to FIG. 16, a modified example (1006) of the multilayer electronic component 1005according to an embodiment is illustrated. A first additional electrodelayer 134 may be disposed between the first connection portion 131 a-6and the third surface, and a second additional electrode layer 135 maybe disposed between the second connection portion 132 a-6 and the fourthsurface. The first additional electrode layer 134 may be disposed withina range that does not deviate from the third surface, and the secondadditional electrode layer 135 may be disposed within a range that doesnot deviate from the fourth surface. The first and second additionalelectrode layers 134 and 135 may improve electrical connectivity betweenthe internal electrodes 121 and 122 and the external electrodes 131-6and 132-6, and the first and second additional electrode layers 134 and135 have excellent bonding strength with the external electrodes 131-6and 132-6, thereby serving to further improve the mechanical bondingforce of the external electrodes 131-6 and 132-6.

The first and second external electrodes 131-6 and 132-6 may have anL-shape in which the first and second external electrodes are notdisposed on the second surface.

The first external electrode 131-6 may include a first connectionportion 131 a-6 disposed on the first additional electrode layer 134,and a first band portion 131 b-6 extending from the first connectionportion 131 a-6 onto a portion of the first surface 1. The secondexternal electrode 132-6 may include a second connection portion 132 a-6disposed on the second additional electrode layer 135, and a second bandportion 132 b-6 extending from the second connection portion 132 a-6onto a portion of the first surface 1.

On the other hand, the first and second additional electrode layers131-6 and 132-6 may be formed of any material as long as they haveelectrical conductivity, such as metal, and a detailed material may bedetermined in consideration of electrical characteristics and structuralstability. In addition, the first and second additional electrode layers131-6 and 132-6 may be firing electrodes including a conductive metaland glass, or resin-based electrodes including a conductive metal and aresin. In addition, the first and second additional electrode layers131-6 and 132-6 may be formed by transferring a sheet including aconductive metal onto the body.

As the conductive metal included in the first and second additionalelectrode layers 131-6 and 132-6, a material having excellent electricalconductivity may be used, but is not particularly limited. For example,the conductive metal may be at least one of Cu, Ni, Pd, Ag, Sn, Cr, andalloys thereof. In detail, the first and second additional electrodelayers 131-6 and 132-6 may include at least one of Ni and a Ni alloy,and accordingly, connectivity with the internal electrodes 121 and 122including Ni may be further improved.

FIG. 17 is a schematic perspective view of a multilayer electroniccomponent 1007 according to an embodiment, and FIG. 18 is across-sectional view taken along line VII-VII′ of FIG. 17 .

Referring to FIGS. 17 and 18 , an average thickness t1 of first andsecond plating layers 141-6 and 142-6 of the multilayer electroniccomponent 1007 according to an embodiment may be less than an averagethickness t2 of an insulating layer 151-6.

The insulating layer 151-6 serves to prevent penetration of externalmoisture or penetration of the plating solution, and the poorconnectivity with the plating layers 141-6 and 142-6 may causedelamination of the plating layers 141-6 and 142-6. When the platinglayer is delaminated, adhesion strength to the substrate 180 may bereduced. In this case, the delamination of the plating layers 141-6 and142-6 may indicate that the plating layer is partially separated or isphysically separated from the external electrodes 131-5 and 132-5.Because the connection between the plating layer and the insulatinglayer is relatively weak, there is a high possibility that the gapbetween the insulating layer and the plating layer will widen or foreignsubstances will penetrate. The possibility of delamination may increaseas it becomes vulnerable to external shocks and the like.

According to an embodiment, the average thickness t1 of the platinglayer is less than the average thickness t2 of the insulating layer. Thecontact area between the plating layer and the insulating layer may bereduced. Accordingly, the occurrence of delamination is suppressed andthe bonding strength of the multilayer electronic component 1000 to thesubstrate 180 may be improved.

The average thickness t1 of the first and second plating layers 141-6and 142-6 may be a value obtained by averaging the thicknesses measuredat five equally spaced points on the first and second connectionportions 131 a-5 and 132 a-5 or the first and second band portions 131b-5 and 132 b-5, and the average thickness t2 of the insulating layer151-6 may be a value obtained by averaging thicknesses measured at fivepoints at equal intervals on the first and second connection portions131 a-5 and 132 a-5.

FIG. 19 is a schematic perspective view of a multilayer electroniccomponent 1008 according to an embodiment. FIG. 20 is a cross-sectionalview taken along line XIV-XIV′ of FIG. 18 .

Referring to FIGS. 19 and 20 , a cover layer 171 including an insulatingmaterial may be disposed on the insulating layer 151-7 of the multilayerelectronic component 1008 according to an embodiment.

As described above, since the oxide containing Ba included in theinsulating layer 151-7 has the property of a desiccant to adsorbmoisture and gas, by adsorbing moisture and gas flowing in from theoutside, it may serve to block penetration of moisture and gas into thefirst and second connection portions 131 a and 132 a and the body 110.In addition, when moisture and gas penetrate into the first and secondconnection portions 131 a and 132 a and the body 110 through otherpaths, it may serve to induce moisture and gas to escape to the outsideagain. However, since the oxide containing Ba included in the insulatinglayer basically acts as a desiccant, if excessive moisture and gaspermeate, moisture resistance reliability may not be sufficientlysecured. Accordingly, by disposing a cover layer 171 including aninsulating material on the insulating layer 151-7 to prevent moisturefrom penetrating into the insulating layer 151-7 from the outside, themoisture resistance reliability may be more reliably improved. Inaddition, even in the case in which a crack occurs in the cover layer171, the insulating layer 151-7 may serve to prevent cracks frompropagating into the first and second connection portions 131 a and 132a and the body 110, thereby suppressing the occurrence of cracks.

The insulating material included in the cover layer 171 does not need tobe particularly limited, and the cover layer 171 may include aninsulating material to have an electrically insulating property. Forexample, the cover layer 171 may include at least one selected from anepoxy resin, an acrylic resin, ethyl cellulose, and the like, or mayinclude glass.

In an embodiment, the material included in the cover layer 171 may beglass. When the cover layer 171 includes glass, cracks may occur, but asdescribed above, since the insulating layer 151-7 may suppresspropagation of cracks into the first and second connection portions 131a and 132 a and the body 110, the occurrence of cracks may besuppressed. Therefore, when the material included in the cover layer 171is glass, the crack suppression effect of the insulating layer 151-7according to an embodiment of the present disclosure may be moresignificant. In more detail, as a material constituting the cover layer171, a glass material having a mole fraction of Si of 20 mol % or moreand 65 mol % or less with respect to the cover layer 171 may bepreferable as glass having excellent resistance to plating solution.

In an embodiment, the material included in the cover layer 171 may be atleast one selected from an epoxy resin, an acrylic resin, and ethylcellulose. Accordingly, moisture may be prevented from penetrating intothe insulating layer 151-7 from the outside, thereby more reliablyimproving the moisture resistance reliability.

FIG. 21 is a schematic perspective view of a multilayer electroniccomponent 2000 according to an embodiment. FIG. 22 is a cross-sectionalview taken along line VIII-VIII′ of FIG. 21 .

Hereinafter, the multilayer electronic component 2000 according to anembodiment will be described in detail with reference to FIGS. 21 and 22. However, content overlapping with the above-described content may beomitted to avoid duplicated description.

The multilayer electronic component 2000 according to an embodiment mayinclude a body 110 including a dielectric layer 111, first and secondinternal electrodes 121 and 122 alternately disposed with the dielectriclayer 111 interposed therebetween, and having first and second surfaces1 and 2 opposing each other in a first direction, third and fourthsurfaces 3 and 4 connected to the first and second surfaces and opposingeach other in the second direction, and fifth and sixth surfaces 5 and 6connected to the first to fourth surfaces 1 to 4 and opposing each otherin the third direction; a first external electrode 231 including a firstconnection electrode 231 a disposed on the third surface and a firstband electrode 231 b disposed on the first surface and connected to thefirst connection electrode 231 a; a second external electrode 232including a second connection electrode 232 a disposed on the fourthsurface and a second band electrode 232 b disposed on the first surfaceand connected to the second connection electrode 232 a; a firstinsulating layer 251 disposed on the first connection electrode 231 a; asecond insulating layer 252 disposed on the second connection electrode232 a; a first plating layer 241 disposed on the first band electrode231 b; and a second plating layer 242 disposed on the second bandelectrode 232 b. The first and second insulating layers 251 and 252 mayinclude an oxide containing Ba.

The first connection electrode 231 a may be disposed on the thirdsurface 3 and is connected to the first internal electrode 121, and thesecond connection electrode 231 b may be disposed on the fourth surface4 to be connected to the second internal electrode 122. In addition, afirst insulating layer 251 is disposed on the first connection electrode231 a, and a second insulating layer 252 may be disposed on the secondconnection electrode 232 a.

In the related art, when forming an external electrode, a method ofdipping the exposed surface of the internal electrode of the body intothe paste using a paste containing a conductive metal is mainly used.However, in the case of the external electrode formed by the dippingmethod, the thickness of the external electrode in the central portionin the thickness direction may be too thick. In addition, even if it isnot a problem of the thickness imbalance of the external electrodeaccording to this dipping method, because the internal electrode isexposed to the third and fourth surfaces of the body, in order tosuppress the penetration of moisture and plating solution through theexternal electrode, the thickness of the external electrodes disposed onthe third and fourth surfaces is formed to be a certain level or more.

Meanwhile, in the present disclosure, since the insulating layers 251and 252 are disposed on the connection electrodes 231 a and 232 a, evenwhen the thickness of the connection electrodes 231 a and 232 a on thethird and fourth surfaces to which the internal electrodes are exposedis relatively reduced, sufficient reliability may be secured.

The first and second connection electrodes 231 a and 232 a may have ashape corresponding to the third and fourth surfaces 3 and 4,respectively, and surfaces of the first and second connection electrodes231 a and 232 a facing the body 110 may have the same area as the thirdand fourth surfaces 3 and 4 of the body 110, respectively. The first andsecond connection electrodes 231 a and 232 a may be disposed within arange that does not deviate from the third and fourth surfaces 3 and 4,respectively. The connection electrodes 231 a and 232 a may be disposedso as not to extend to the first, second, fifth, and sixth surfaces 1,2, 5, and 6 of the body 110. In detail, in an embodiment, the first andsecond connection electrodes 231 a and 232 a may be disposed to bespaced apart from the fifth and sixth surfaces 5 and 6. Accordingly,while securing sufficient connectivity between the internal electrodes121 and 122 and the external electrodes 231 and 232, the volume occupiedby the external electrodes is significantly reduced. The capacitance ofthe multilayer electronic component 2000 per unit volume may beincreased.

In this regard, the first and second connection electrodes 231 a and 232a may be disposed to be spaced apart from the second surface 2. Forexample, as the external electrodes 231 and 232 are not disposed on thesecond surface, by further significantly reducing the volume occupied bythe external electrodes 231 and 232, the capacitance of the multilayerelectronic component 2000 per unit volume may be further increased.

However, the connection electrodes 231 a and 232 a may extend to an edgeof the body 110 and include an edge portion disposed on the edge. Forexample, in an embodiment, the first connection electrode 231 a includesedge portions disposed to extend onto the 1-3 edge and the 2-3 edge, andthe second connection electrode 232 a may include edge portionsextending onto the 1-4 edge and the 2-4 edge.

In addition, the connection electrodes 231 a and 232 a may have auniform and thinner thickness than an external electrode formed by adipping method of the related art.

The method of forming the connection electrodes 231 a and 232 a does notneed to be particularly limited, and for example, the connectionelectrodes 231 a and 232 a may be formed by transferring a sheetincluding a conductive metal and an organic material such as a binder tothe third and fourth surfaces.

The thickness of the connection electrodes 231 a and 232 a is notparticularly limited, but may be, for example, 2 to 7 μm. In this case,the thickness of the connection electrodes 231 a and 232 a may indicatea maximum thickness, and may indicate the size of the connectionelectrodes 231 a and 232 a in the second direction.

In an embodiment, the first and second connection electrodes 231 a and232 a may include the same metal and glass as those included in theinternal electrodes 121 and 122. As the first and second connectionelectrodes 231 a and 232 a include the same metal as the metal includedin the internal electrodes 121 and 122, electrical connectivity with theinternal electrodes 121 and 122 may be more improved, and as the firstand second connection electrodes 231 a and 232 a include glass, bondingforce with the body 110 and/or the insulating layers 251 and 252 may beimproved. In this case, the same metal as the metal included in theinternal electrodes 121 and 122 may be Ni.

The first and second insulating layers 251 and 252 may be disposed onthe first and second connection electrodes 231 a and 232 a,respectively, and serve to prevent a plating layer from being formed onthe first and second connection electrodes 231 a and 232 a. In addition,the first and second insulating layers 251 and 252 may serve tosignificantly reduce penetration of moisture or plating solution fromthe outside by improving sealing characteristics.

The first and second insulating layers 251 and 252 may include an oxidecontaining Ba. By applying an oxide containing Ba instead of aglass-based oxide to the first and second insulating layers 251 and 252,the moisture resistance reliability may be further improved, and crackscaused by heat shrinkage and radiation cracks caused by metal diffusionmay be suppressed.

The first and second band electrodes 231 b and 232 b may be disposed onthe first surface 1 of the body 110. The first and second bandelectrodes 231 b and 232 b are in contact with the first and secondconnection electrodes 231 a and 232 a, respectively, to be electricallyconnected to the first and second internal electrodes 121 and 122.

An external electrode formed by the related art dipping method isthickly formed on the third and fourth surfaces and partially extendedto the first, second, fifth and sixth surfaces, thereby causing aproblem in that it is difficult to secure a high effective volume ratio.

Meanwhile, according to an embodiment of the present disclosure, thefirst and second connection electrodes 231 a and 232 a are disposed onthe surface to which the internal electrodes are exposed, and the firstand second band electrodes 231 b and 232 b are disposed on the surfaceto be mounted on the substrate, thereby securing a relatively higheffective volume ratio.

On the other hand, when the internal electrodes 121 and 122 are stackedin the first direction, the multilayer electronic component 2000 may behorizontally mounted on a substrate such that the internal electrodes121 and 122 are parallel to the mounting surface. However, the presentdisclosure is not limited to the case of horizontal mounting, and whenthe internal electrodes 121 and 122 are stacked in the third direction,the multilayer electronic component may be vertically mounted on thesubstrate so that the internal electrodes 121 and 122 are perpendicularto the mounting surface.

The first and second band electrodes 231 b and 232 b may be formed ofany material as long as they have electrical conductivity, such asmetal, and a detailed material may be determined in consideration ofelectrical characteristics, structural stability, and the like. Forexample, the first and second band electrodes 231 and 232 b may befiring electrodes including a conductive metal and glass, and may beformed using a method of applying a paste containing a conductive metaland glass to the first surface of the body, but the present disclosureis not limited thereto. For example, the first and second bandelectrodes 231 and 232 b may be plating layers in which a conductivemetal is plated on the first surface of the body.

As a conductive metal included in the first and second band electrodes231 b and 232 b, a material having excellent electrical conductivity maybe used and is not particularly limited. For example, the conductivemetal may be at least one of nickel (Ni), copper (Cu), and alloysthereof, and may include the same metal as the metal included in theinternal electrodes 121 and 122.

On the other hand, in an embodiment, the first external electrode 231further includes a third band electrode (not illustrated) disposed onthe second surface 2 and connected to the first connection electrode 231a, and the second external electrode 232 may further include a fourthband electrode (not illustrated) disposed on the second surface 2 andconnected to the second connection electrode 232 a.

In an embodiment, when the distance from an extension line E3 of thethird surface to the end of the first band electrode 231 b is B1, thedistance from the extension line E4 of the fourth surface 4 to the endof the second band electrode 232 b is B2, the distance from theextension line E3 of the third surface 3 to the end of the third bandelectrode (not illustrated) is B3, the distance from the extension lineE4 of the fourth surface 4 to the end of the fourth band electrode (notillustrated) is B4, the second direction average size of the region inwhich the third surface 3 and the second internal electrode 122 arespaced apart is G1, and the average size in the second direction of theregion in which the fourth surface 4 and the first internal electrode121 are spaced apart is G2, B1≥G1, B3≤G1, B2≥G2 and B4≤G2 may besatisfied. Accordingly, the volume occupied by the external electrode issignificantly reduced to increase the capacitance of the multilayerelectronic component 2000 per unit volume, and simultaneously, the areain contact with the solder in mounting may be increased, therebyimproving the bonding strength.

However, it is not intended to limit the present disclosure to B1≥G1,B3≤G1, B2≥G2 and B4≤G2, and the case in which B1≥G1, B3≥G1, B2≥G2 andB4≥G2 are satisfied may also be included in an embodiment of the presentdisclosure. Accordingly, in an embodiment, when the distance from theextension line E3 of the third surface 3 to the end of the first bandelectrode 231 b is B1, the distance from the extension line E4 of thefourth surface 4 to the end of the second band electrode 232 b is B2,the distance from the extension line E3 of the third surface 3 to theend of the third band electrode (not illustrated) is B3, the distancefrom the extension line E4 of the fourth surface 4 to the end of thefourth band electrode (not illustrated) is B4, the second directionaverage size of the region in which the third surface 3 and the secondinternal electrode 122 are spaced apart is G1, and the average size inthe second direction of the region in which the fourth surface 4 and thefirst internal electrode 121 are spaced apart is G2, B1≥G1, B3≥G1, B2≥G2and B4≥G2 may be satisfied. Accordingly, any one of the first and secondsurfaces may be used as the mounting surface, and thus the mountingconvenience may be improved.

The first and second plating layers 241 and 242 may be disposed on thefirst and second band electrodes 231 b and 232 b. The first and secondplating layers 241 and 242 serve to improve mounting characteristics.The types of the first and second plating layers 241 and 242 are notparticularly limited, and may be a plating layer including at least oneof Ni, Sn, Pd, and alloys thereof, and may be formed of a plurality oflayers.

For a more detailed example of the first and second plating layers 241and 242, the first and second plating layers 241 and 242 may be a Niplating layer or a Sn plating layer, and the Ni plating layer and the Snplating layer may be sequentially formed on the first and second bandelectrodes 231 b and 232 b.

In an embodiment, the first and second plating layers 241 and 242 mayextend to partially cover the first and second connection electrodes 231a and 232 a, respectively.

When the average size of the first direction from the first surface 1 tothe internal electrode disposed closest to the first surface 1 among thefirst and second internal electrodes 121 and 122 is H1 is, and theaverage size in the first direction from the extension line E1 of thefirst surface 1 to the ends of the first and second plating layers 241and 242 disposed on the first and second connection electrodes 231 a and232 a is H2, H1>H2 (or H1≥H2) may be satisfied. Accordingly, thepenetration of the plating solution into the internal electrode duringthe plating process may be suppressed, thereby improving reliability.

In an embodiment, the first and second insulating layers 251 and 252 aredisposed to be in direct contact with the first and second connectionelectrodes 231 a and 232 a, respectively, and the first and secondconnection electrodes 231 a and 232 a may include a conductive metal andglass. Accordingly, the plating layers 241 and 242 may not be disposedon the regions in which the insulating layers 251 and 252 are disposedamong the external surfaces of the first and second connectionelectrodes 231 a and 232 a, and erosion of the external electrode by theplating solution may be effectively prevented.

In an embodiment, the first plating layer 241 is disposed to cover theend of the first insulating layer 251 disposed on the first externalelectrode 231, and the second plating layer 242 may be disposed to coveran end of the second insulating layer 252 disposed on the secondexternal electrode 232. Accordingly, the reliability of a multilayerelectronic component 3000 may be improved by strengthening the bondingforce between the insulating layers 251 and 252 and the plating layers241 and 242. In addition, by first forming the first and secondinsulating layers 251 and 252 before forming the plating layers 241 and242 on the external electrodes 231 and 232, penetration of the platingsolution in the process of forming the plating layer may be morereliably suppressed. As the insulating layer is formed before theplating layer, the plating layers 241 and 242 may have a shape coveringthe ends of the insulating layers 251 and 252.

In an embodiment, the first insulating layer 251 is disposed to coverthe end of the first plating layer 241 disposed on the first externalelectrode 231, and the second insulating layer 252 may be disposed tocover an end of the second plating layer 242 disposed on the secondexternal electrode 232. Accordingly, the reliability of the multilayerelectronic component 3000 may be improved by strengthening the bondingforce between the insulating layer 251 and the plating layers 241 and242.

FIG. 23 illustrates a modified example of FIG. 21 . Referring to FIG. 23, a modified example 2001 of the multilayer electronic component 2000according to an embodiment is illustrated. First and second insulatinglayers 251-1 and 252-1 extend to the fifth and sixth surfaces 5 and 6and are connected to each other, thereby being connected as oneinsulating layer 253-1. In this case, the connected first and secondinsulating layer 253-1 may be disposed to cover portions of the fifthand sixth surfaces.

FIG. 24 is a schematic perspective view of a multilayer electroniccomponent 2002 according to an embodiment. FIG. 25 is a cross-sectionalview taken along line IX-IX′ of FIG. 24 .

Referring to FIGS. 24 and 25 , in a multilayer electronic component 2002according to an embodiment, first and second plating layers 241-2 and242-2 may be disposed on a level the same as or below an extension lineE1 of the first surface 1. Accordingly, the height of the solder may besignificantly reduced during mounting, and the mounting space may besignificantly reduced.

In addition, the first and second insulating layers 251-2 and 252-2 mayextend below an extension line E2 of the first surface 1 and be disposedto contact the first and second plating layers 241-2 and 242-2.

FIG. 26 illustrates a modified example of FIG. 24 . Referring to FIG. 26, a modified example 2003 of the multilayer electronic component 2002according to an embodiment is illustrated. First and second insulatinglayers 251-3 and 252-3 extend to the fifth and sixth surfaces 5 and 6and are connected to each other, thereby being connected as oneinsulating layer 253-3. In this case, the connected first and secondinsulating layer 253-3 may be disposed to cover the entirety of thefifth and sixth surfaces.

FIG. 27 schematically illustrates a multilayer electronic component 2004according to an embodiment. FIG. 28 is a cross-sectional view takenalong line X-X′ of FIG. 27 .

Referring to FIGS. 27 and 28 , a multilayer electronic component 2004according to an embodiment may further include an additional insulatinglayer 261 disposed on the first surface 1 and disposed between the firstband electrode 231 b and the second band electrode 232 b. Accordingly,leakage current that may occur between the first band electrode 231 band the second band electrode 232 b under a high voltage current may beprevented.

The type of the additional insulating layer 261 does not need to beparticularly limited. For example, the additional insulating layer 261may include an oxide containing Ba, like the first and second insulatinglayers 251-2 and 252-2, and may contain BaO, and may be BaO. However, itis not necessary to limit the additional insulating layer 261 and thefirst and second insulating layers 251-2 and 252-2 to the same material,and may be formed to have different materials. For example, theadditional insulating layer 261 may include at least one selected fromepoxy resin, acrylic resin, ethyl cellulose, and the like or theadditional insulating layer 261 may include glass.

FIG. 29 illustrates a modified example of FIG. 27 . Referring to FIG. 29, a modified example (2005) of the multilayer electronic component 2004according to an embodiment is illustrated. First and second insulatinglayers 251-5 and 252-5 extend to the fifth and sixth surfaces 5 and 6and are connected to each other to be connected as one insulating layer253-5.

FIG. 30 is a schematic perspective view of a multilayer electroniccomponent 2006 according to an embodiment. FIG. 31 is a cross-sectionalview taken along line XI-XI′ of FIG.

Referring to FIGS. 30 and 31 , the multilayer electronic component 2006according to an embodiment includes a first insulating layer 251-6disposed on the first connection electrode 231 a, and a secondinsulating layer 252-6 disposed on the second connection electrode 232a. When H1 is the average size in the first direction from the firstsurface 1 to the internal electrode disposed closest to the firstsurface 1 among the first and second internal electrodes 121 and 122,and an average size in the first direction from the extension line E1 ofthe first surface 1 to the ends of the plating layers 241-6 and 242-6disposed on the first and second connection electrodes 231 a and 232 ais H2, H1<H2 may be satisfied. Accordingly, by increasing the area incontact with the solder during mounting, the fixing strength may beimproved.

In detail, when the average size of the body 110 in the first directionis T, H2<T/2 may be satisfied. For example, H1<H2<T/2 may be satisfied.If H2 is T/2 or more, there is a possibility that themoisture-resistance reliability improvement effect by an insulatinglayer may deteriorate.

FIG. 32 illustrates a modified example of FIG. 30 . Referring to FIG. 32, a modified example 2007 of the multilayer electronic component 2006according to an embodiment is illustrated. First and second insulatinglayers 251-7 and 252-7 extend to the fifth and sixth surfaces 5 and 6and are connected to each other to be connected as one insulating layer253-7.

FIG. 33 is a schematic perspective view of a multilayer electroniccomponent 2008 according to an embodiment. FIG. 34 is a cross-sectionalview taken along line XII-XII′ of FIG. 33 .

Referring to FIGS. 33 and 34 , in the multilayer electronic component2008 according to an embodiment, first and second insulating layers251-8 and 252-8 may extend to the second, fifth and sixth surfaces 2, 5and 6 and may be connected to each other to be connected as oneinsulating layer 253-8. As illustrated in FIG. 33 , the multilayerelectronic component 2008 may have a form in which the insulating layer253-8 covers the entirety of the second surface and only partiallycovers the fifth and sixth surfaces.

FIG. 35 is a schematic perspective view of a multilayer electroniccomponent 2009 according to an embodiment. FIG. 36 is a cross-sectionalview taken along line XIII-XIII′ of FIG. 35 .

Referring to FIGS. 35 and 36 , an average thickness t1′ of first andsecond plating layers 241-9 and 242-9 of the multilayer electroniccomponent 2009 according to an embodiment may be less than an averagethickness t2′ of first and second insulating layers 251-9 and 252-9.

According to an embodiment, as the average thickness t1′ of the firstand second plating layers 241-9 and 242-9 is less than the averagethickness t2′ of the first and second insulating layers 251-9 and 252-9,the contact area between the plating layer and the insulating layer maybe reduced. Accordingly, the occurrence of delamination is suppressedand the bonding strength of the multilayer electronic component 2009 tothe substrate 180 may be improved.

The average thickness t1′ of the first and second plating layers 241-9and 242-9 may be an average value of thicknesses measured at equalintervals at five points on the first and second connection electrodes231 a and 232 a or the first and second band electrodes 231 b and 232 b,and the average thickness t2′ of the insulating layers 251-9 and 252-9may be an average of thicknesses measured at five equally spaced pointson the first and second connection electrodes 231 a and 232 a.

FIG. 37 illustrates a modified example of FIG. 35 . Referring to FIG. 37, a modified example 2010 of the multilayer electronic component 2009according to an embodiment is illustrated. First and second insulatinglayers 251-10 and 252-10 extend to the fifth and sixth surfaces 5 and 6and are connected to each other to be connected as one insulating layer253-10.

FIG. 38 is a schematic perspective view of a multilayer electroniccomponent 2011 according to an embodiment. FIG. 39 is a cross-sectionalview taken along line XV-XV′ of FIG. 38 .

Referring to FIGS. 38 and 39 , on first and second insulating layers251-11 and 252-11 of the multilayer electronic component 2011 accordingto an embodiment, first and second cover layers 271 and 272 eachincluding an insulating material may be disposed.

As described above, by disposing the cover layers 271 and 272 includingthe insulating material on the insulating layers 251-11 and 252-11 toprevent moisture from penetrating into the insulating layers 251-11 and252-11 from the outside, the moisture-resistance reliability may beimproved more reliably. In addition, even if cracks occur in the coverlayers 271 and 272, the insulating layers 251-11 and 252-11 may serve toprevent cracks from propagating into the first and second connectionelectrodes 231 a and 232 a and the body 110, and the occurrence ofcracks may be suppressed.

The insulating material included in the cover layers 271 and 272 doesnot need to be particularly limited, and the cover layers 271 and 272may include an insulating material to have an electrically insulatingproperty. For example, the cover layers 271 and 272 include at least oneselected from an epoxy resin, an acrylic resin, ethyl cellulose, and thelike or may include glass.

In an embodiment, the material included in the cover layers 271 and 272may be glass. When the cover layers 271 and 272 include glass, cracksmay occur, but as described above, the insulating layers 251-11 and252-11 may suppress propagation of cracks into the first and secondconnection electrodes 231 a and 232 a and the body 110. The occurrenceof cracks may be suppressed. Therefore, when the material included inthe cover layers 271 and 272 is glass, the crack suppression effect ofthe insulating layers 251-11 and 252-11 of the present disclosure may bemore significant. In detail, as a material constituting the cover layers271 and 272, and as a glass with excellent resistance to platingsolution, a glass material having a mole fraction of Si of 20 mol % ormore and 65 mol % or less may be used.

In an embodiment, the material included in the cover layers 271 and 272may be at least one selected from an epoxy resin, an acrylic resin, andethyl cellulose. Accordingly, moisture may be prevented from penetratinginto the insulating layers 251-11 and 252-11 from the outside, andmoisture resistance reliability may be improved more reliably.

FIG. 40 is a schematic diagram illustrating a perspective view of amultilayer electronic component 3000 according to an embodiment. FIG. 41is a cross-sectional view taken along line XVI-XVI′ of FIG. 40 . FIG. 42is an enlarged view of area K1 of FIG. 40 .

Referring to FIGS. 40 to 42 , the multilayer electronic component 3000according to an embodiment includes a body 110 including a dielectriclayer 111 and first and second internal electrodes 121 and 122alternately disposed with the dielectric layer 111 interposedtherebetween, and having first and second surfaces 1 and 2 opposing eachother in a first direction, third and fourth surfaces 3 and 4 connectedto the first and second surfaces 1 and 2 and opposing each other in thesecond direction, and fifth and sixth surfaces 5 and 6 connected to thefirst to fourth surfaces 1 to 4 and opposing each other in the thirddirection; a first external electrode 331 including a first connectionportion 331 a disposed on the third surface 3 of the body, a first bandportion 331 b extending from the first connection portion 331 a onto aportion of the first surface 1, and a first edge portion 331 c extendingfrom the first connection portion 331 a to an edge connecting the secondand third surfaces 2 and 3 of the body; a second external electrode 332including a second connection portion 332 a disposed on the fourthsurface 4 of the body, a second band portion 332 b extending from thesecond connection portion 332 a onto a portion of the first surface 1,and a second edge portion 332 c extending from the second connectionportion 332 a to an edge connecting the second and fourth surfaces 2 and4 of the body; an insulating layer 351 disposed on the first and secondconnection portions 331 a and 332 a and disposed to cover the secondsurface 2 and the first and second edge portions; a first plating layer341 disposed on the first band portion 331 b; and a second plating layer342 disposed on the second band portion 332 b. The an insulating layer351 may include an oxide including Ba.

In an embodiment, when the average size in the second direction from theextension line E2 of the third surface 3 to the end of the first edgeportion 331 c is B3, the average size in the second direction from theextension line E4 of the fourth surface 4 to the end of the second edgeportion 332 c is B4, the average size in the second direction of theregion in which the third surface 3 and the second internal electrode122 are spaced apart is G1, and the average size in the second directionof the region in which the fourth surface 4 and the first internalelectrode 121 are spaced apart is G2, B3 G1 and B4 G2 may be satisfied.Accordingly, by significantly reducing the volume occupied by theexternal electrodes 331 and 332, the capacitance of the multilayerelectronic component 3000 per unit volume may be increased.

In this case, when the average size in the second direction from theextension line E3 of the third surface 3 to the end of the first bandportion 331 b is B1, and the average size in the second direction fromthe extension line E4 of the fourth surface 4 to the end of the secondband portion 332 b is B2, B1?G1 and B2?G2 may be satisfied. Accordingly,by increasing the area in contact with the solder during mounting, thefixing strength may be improved.

The multilayer electronic component 3000 according to an embodiment mayinclude a body 110 that includes a dielectric layer 111 and first andsecond internal electrodes 121 and 122 alternately disposed with thedielectric layer 111 interposed therebetween and has first and secondsurfaces 1 and 2 opposing each other in a first direction, third andfourth surfaces 3 and 4 connected to the first and second surfaces 1 and2 and opposing each other in the second direction, and fifth and sixthsurfaces 5 and 6 connected to the first to fourth surfaces 1 to 4 andopposing each other in the third direction. The body 110 of themultilayer electronic component 3000 may have the same configuration asthe body 110 of the multilayer electronic component 1000 except that theend of the first or second surface of the body has a contracted shape,as will be described later.

The external electrodes 331 and 332 may be disposed on the third surface3 and the fourth surface 4 of the body 110. The external electrodes 331and 332 may include first and second external electrodes 331 and 332respectively disposed on the third and fourth surfaces 3 and 4 of thebody 110 and connected to the first and second internal electrodes 121and 122, respectively.

The external electrodes 331 and 332 may include the first externalelectrode 331 including a first connection portion 331 a disposed on thethird surface 3, a first band portion 331 b extending from the firstconnection portion 331 a onto a portion of the first surface 1, and afirst edge portion 331 c extending from the first connection portion 331a to an edge connecting the second surface 2 and the third surface 3;and the second external electrode 332 including a second connectionportion 332 a disposed on the fourth surface 4, a second band portion332 b extending from the second connection portion 332 a onto a portionof the first surface 1, and a second edge portion 332 c extending fromthe second connection portion 332 a to an edge connecting the secondsurface 2 and the fourth surface 4. The first connection portion 331 ais connected to the first internal electrode 121 on the third surface 3,and the second connection portion 332 a may be connected to the secondinternal electrode 122 on the fourth surface 4.

In an embodiment, the first and second connection portions 331 a and 332a may be disposed to be spaced apart from the fifth and sixth surfaces 5and 6. Accordingly, the region of the external electrodes 331 and 332may be significantly reduced and the multilayer electronic component3000 may be further miniaturized.

As a margin region in which the internal electrodes 121 and 122 are notdisposed is overlapped on the dielectric layer 111, a step differenceoccurs due to the thickness of the internal electrodes 121 and 122, andthe edge connecting the first surface and the third to fifth surfacesand/or the edge connecting the second surface and the third to the fifthsurface may have a shape that is contracted toward the center of thebody 110 in the first direction, when viewed from the first surface orthe second surface. Alternatively, by the shrinkage behavior in thesintering process of the body, an edge connecting the first surface 1and the third to sixth surfaces 3, 4, 5 and 6 and/or an edge connectingthe second surface 2 and the third to sixth surfaces 3, 4, 5 and 6 mayhave a shape that is contracted toward the center of the body 110 in thefirst direction, when viewed from the first surface or the secondsurface. Alternatively, as the edges connecting respective surfaces ofthe body 110 are rounded by performing a separate process to preventchipping defects and the like, an edge connecting the first surface andthe third to sixth surfaces and/or an edge connecting the second surfaceand the third to sixth surfaces may have a rounded shape.

The edge may include a 1-3 edge C1-3 connecting the first surface andthe third surface, a 1-4 edge C1-4 connecting the first and fourthsurfaces, a 2-3 edge C2-3 connecting the second surface and the thirdsurface, and a 2-4 edge C2-4 connecting the second surface and thefourth surface. Also, the edge may include a 1-5 edge connecting thefirst surface and the fifth surface, a 1-6 edge connecting the firstsurface and the sixth surface, a 2-5 edge connecting the second surfaceand the fifth surface, and a 2-6 edge connecting the second surface andthe sixth surface. However, to suppress the step difference caused bythe internal electrodes 121 and 122, after lamination, the internalelectrodes are cut to be exposed to the fifth and sixth surfaces 5 and 6of the body, and then a single dielectric layer or two or moredielectric layers are disposed on both sides of the capacitanceformation portion Ac in the third direction (width direction). In thecase of forming the margin portions 114 and 115 by laminating, a portionconnecting the first surface and the fifth and sixth surfaces and aportion connecting the second surface and the fifth and sixth surfacesmay not have a contracted shape.

On the other hand, the first to sixth surfaces of the body 110 may besubstantially flat surfaces, and non-flat regions may be provided asedges. Also, a region disposed on an edge among the external electrodes131 and 132 may be regarded as an edge portion.

In this regard, the first and second edge portions 331 c and 332 c maybe disposed below an extension line E2 of the second surface, and thefirst and second edge portions 331 c and 332 c may be disposed to bespaced apart from the second surface. For example, as the externalelectrodes 331 and 332 are not disposed on the second surface, byfurther significantly reducing the volume occupied by the externalelectrodes 331 and 332, the capacitance of the multilayer electroniccomponent 3000 per unit volume may be further increased. In addition,the first edge portion 331 c may be disposed on a portion of the 2-3edge C2-3 connecting the third surface and the second surface, and thesecond edge portion 332 c may be disposed on a portion of the secondedge C2-4 connecting the fourth surface and the second surface.

The extension line E2 of the second surface may be defined as follows.

In the length-thickness cross section (L-T cross-section) of themultilayer electronic component 3000 cut at the center in the widthdirection, by drawing 7 straight lines (P0, P1, P2, P3, P4, P5, P6, P7)in the thickness direction with equal intervals in the length directionfrom the third surface to the fourth surface, a straight line passingthrough the point where P2 and the second surface meet and the pointwhere P4 and the second surface meet may be defined as the extensionline E2 of the second surface.

On the other hand, the external electrodes 331 and 332 may be formedusing any material as long as they have electrical conductivity, such asa metal, and a detailed material may be determined in consideration ofelectrical properties, structural stability, or the like. Furthermore,the external electrodes may have a multilayer structure.

The external electrodes 331 and 332 are firing electrodes including aconductive metal and glass, or may be a resin-based electrode includinga conductive metal and a resin.

In addition, the external electrodes 331 and 332 may have a shape inwhich a firing electrode and a resin-based electrode are sequentiallyformed on a body.

In addition, the external electrodes 331 and 332 are formed bytransferring a sheet including a conductive metal on the body, or may beformed by transferring a sheet including a conductive metal onto thefiring electrode.

As the conductive metal included in the external electrodes 331 and 332,a material having excellent electrical conductivity may be used, and thematerial is not particularly limited. For example, the conductive metalmay be at least one of Cu, Ni, Pd, Ag, Sn, Cr, and alloys thereof. Indetail, the external electrodes 331 and 332 may include at least one ofNi and a Ni alloy, and accordingly, connectivity with the internalelectrodes 121 and 122 including Ni may be further improved.

The insulating layer 351 may be disposed on the first and secondconnection portions 331 a and 332 a.

The first and second connection portions 331 a and 332 a are portionsconnected to the internal electrodes 121 and 122, in the platingprocess, and may thus be the path of penetration of the plating solutionor moisture penetration during actual use. In the present disclosure,since the insulating layer 351 is disposed on the connection portions331 a and 332 a, penetration of external moisture or a plating solutionmay be prevented.

The insulating layer 351 may be disposed to contact the first and secondplating layers 341 and 342. In this case, the insulating layer 351 maycontact to partially cover the ends of the first and second platinglayers 341 and 342, or the first and second plating layers 341 and 342may contact to partially cover the ends of the insulating layer 351.

The insulating layer 353 is disposed on the first and second connectionportions 331 a and 332 a and may be disposed to cover the second surfaceand the first and second edge portions 331 c and 332 c. In addition, theinsulating layer 351 covers a region in which the ends of the first andsecond edge portions 331 c and 332 c and the body 110 come into contactwith each other, to block the moisture permeation path, thereby furtherimproving moisture resistance reliability.

The insulating layer 351 may be disposed on the second surface to extendto the first and second connection portions 331 a and 332 a. Also, whenthe external electrodes 331 and 332 are not disposed on the secondsurface, the insulating layer may be disposed to completely cover thesecond surface. On the other hand, the insulating layer 351 is notnecessarily disposed on the second surface, and the insulating layer maynot be disposed on a portion or the entirety of the second surface, andthe insulating layer may be divided into two and disposed on the firstand second connection portions 331 a and 332 a, respectively. However,even in this case, the insulating layer may be disposed to completelycover the first and second edge portions 331 c and 332 c. When theinsulating layer is not disposed on the entirety of the second surface,the insulating layer may be disposed below an extension line of thesecond surface. In addition, although the insulating layer is notdisposed on the second surface, the insulating layer may extend from thefirst and second connection portions 331 a and 332 a to the fifth andsixth surfaces to form one insulating layer.

In an embodiment, the insulating layer 351 may be disposed to partiallycover the fifth and sixth surfaces to improve reliability. In this case,portions of the fifth and sixth surfaces that are not covered by theinsulating layer may be exposed externally.

Furthermore, the insulating layer 351 may be disposed to cover theentirety of the fifth and sixth surfaces, and in this case, since thefifth and sixth surfaces are not exposed externally, the moistureresistance reliability may be further improved.

The insulating layer 351 may serve to prevent the plating layers 341 and342 from being formed on the external electrodes 331 and 332 on whichthe insulating layer 351 is disposed, and may play a role insignificantly reducing penetration of moisture or plating solution fromthe outside by improving the sealing characteristics. The component,composition and average thickness of the insulating layer 351, and theeffects accordingly are the same as those of the insulating layers 151,251, 252, and 253 included in the multilayer electronic components 1000and 2000 and various embodiments thereof. Therefore, a descriptionthereof will be omitted.

The first and second plating layers 341 and 342 may be disposed on thefirst and second band portions 331 b and 332 b, respectively. Theplating layers 341 and 342 may serve to improve the mountingcharacteristics, and as the plating layers 341 and 342 are disposed onthe band portions 331 b and 332 b, the mounting space may besignificantly reduced, and reliability may be improved by significantlyreducing penetration of the plating solution into the internalelectrode. One end of the first and second plating layers 341 and 342may contact the first surface, and the other end thereof may contact theinsulating layer 351.

The type of the plating layers 341 and 342 is not particularly limited,and may be a plating layer including at least one of Cu, Ni, Sn, Ag, Au,Pd, and alloys thereof, and may be formed in a plurality of layers.

As a more detailed example of the plating layers 341 and 342, theplating layers 341 and 342 may be a Ni plating layer or a Sn platinglayer, and the Ni plating layer and the Sn plating layer may besequentially formed on the first and second band portions 331 b and 332b.

In an embodiment, the first plating layer 341 is disposed to cover theend of the insulating layer 351 disposed on the first external electrode331, and the second plating layer 342 may be disposed to cover an end ofthe insulating layer 351 disposed on the second external electrode 332.Accordingly, the reliability of the multilayer electronic component 3000may be improved by strengthening the bonding force between theinsulating layer 351 and the plating layers 341 and 342. In addition, byfirst forming the insulating layer 351 before forming the plating layers341 and 342 on the external electrodes 331 and 332, penetration of theplating solution in the process of forming the plating layer may be morereliably suppressed. As the insulating layer is formed before theformation of the plating layer, the plating layers 341 and 342 may havea shape covering the ends of the insulating layer 351.

In an embodiment, the insulating layer 351 may be disposed to cover theend of the first plating layer 341 disposed on the first externalelectrode 331, and the insulating layer 351 may be disposed to cover anend of the second plating layer 342 disposed on the second externalelectrode 332. Accordingly, the reliability of the multilayer electroniccomponent 3000 may be improved by strengthening the bonding forcebetween the insulating layer 351 and the plating layers 341 and 342.

In an embodiment, the first and second plating layers 341 and 342 may beextended to partially cover the first and second connection portions 331a and 332 a, respectively. When the average size in the first directionup to the internal electrode disposed closest to the first surface 1among the first and second internal electrodes 121 and 122 is referredto as H1, and the average size in the first direction from the extensionline E1 of the first surface 1 to the ends of the first and secondplating layers 141 and 142 disposed on the first and second connectionportions 131 a and 132 a is referred to as H2, H1>H2 (or H1≥H2) may besatisfied. Accordingly, the penetration of the plating solution into theinternal electrode during the plating process may be suppressed, therebyimproving reliability.

In an embodiment, when an average size in the first direction from thefirst surface to the internal electrode disposed closest to the firstsurface among the first and second internal electrodes 121 and 122 isH1, and the average size in the first direction from the extension lineE1 of the first surface 1 to the ends of the plating layers 341 and 342disposed on the first and second connection portions 331 a and 332 a isH2, H1<H2 may be satisfied. Accordingly, by increasing the area incontact with the solder during mounting, the fixing strength may beimproved. In detail, when the average size of the body 110 in the firstdirection is T, H2<T/2 may be satisfied. For example, H1<H2<T/2 may besatisfied. If H2 is T/2 or more, there may be a possibility that themoisture-resistance reliability improvement effect by an insulatinglayer may decrease.

In an embodiment, the first and second plating layers 341 and 342 may bedisposed on a level the same as or below an extension line of the firstsurface. Accordingly, the height of the solder may be significantlyreduced during mounting, and the mounting space may be significantlyreduced. In addition, the insulating layer 351 may extend below theextension line of the first surface and be disposed to contact the firstand second plating layers 341 and 342.

In an embodiment, when the average size of the body in the seconddirection is L, the average size of the first band portion 331 b in thesecond direction from the extension line E3 of the third surface 3 tothe end of the first band 331 b is B1, and the average size of thesecond band portion 332 b in the second direction from the extensionline E4 of the fourth surface 4 to the end of the second band portion332 b is B2, 0.2≤B1/L≤0.4 and 0.2≥B2/L≤0.4 may be satisfied.

If B1/L and B2/L are less than 0.2, it may be difficult to securesufficient fixing strength. On the other hand, if B2/L is greater than0.4, there is a risk of leakage current between the first band portion331 b and the second band portion 332 b under high-voltage current, andduring the plating process, there is a concern that the first bandportion 331 b and the second band portion 332 b may be electricallyconnected to each other due to plating spread or the like.

In an embodiment, an additional insulating layer disposed on the firstsurface and disposed between the first band portion 331 b and the secondband portion 332 b may be further included. Accordingly, leakage currentthat may occur between the first band electrode 331 b and the secondband electrode 332 b under a high voltage current may be prevented.

The type of the additional insulating layer does not need to beparticularly limited. For example, the additional insulating layer mayinclude an oxide including Ba like the insulating layer 351. However, itis not necessary to limit the additional insulating layer and theinsulating layer 351 to the same material, and the additional insulatinglayer and the insulating layer 351 may also be formed to have differentmaterials. For example, at least one selected from epoxy resin, acrylicresin, ethyl cellulose, and the like may be included, or glass may beincluded.

In an embodiment, when the average size of the first band portion 331 bin the second direction from the extension line E3 of the third surface3 to the end of the first band portion 331 b is B1, and the average sizeof the second band portion 332 b in the second direction from theextension line E4 of the fourth surface 4 to the end of the second bandportion portion is B2, B3<B1 and B4<B2 may be satisfied. An averagelength B1 of the first band portion 331 b may be longer than an averagelength B3 of the first edge portion 331 c, and the average length of thesecond band portion 332 b may be longer than an average length B4 of thesecond edge portion 332. Accordingly, by increasing the area in contactwith the solder during mounting, the fixing strength may be improved.

In more detail, when the average size of the first band portion 331 b inthe second direction from the extension line of the third surface 3 tothe end of the first band portion 331 b is B1, the average size of thesecond band portion 332 b in the second direction from the extensionline of the fourth surface 4 to the end of the second band portion 332 bis B2, the average size of the first edge portion 331 c in the seconddirection from the extension line E3 of the third surface 3 to the endof the first edge portion 331 c is B3, and the average size of thesecond edge portion 332 c in the second direction from the extensionline E4 of the fourth surface 4 to the end of the second edge portion332 c is B4, B3<B1 and B4<B2 may be satisfied.

In an embodiment, an average thickness of the first and second platinglayers 341 and 342 may be less than an average thickness of theinsulating layer 351.

The insulating layer 351 serves to prevent penetration of externalmoisture or penetration of the plating solution, but connectivitythereof with the plating layers 341 and 342 is relatively weak, whichmay cause delamination of the plating layer. In a case in which theplating layer is delaminated, the fixing strength with the substrate maybe lowered. In this case, the delamination of the plating layer mayindicate that the plating layer is partially separated or is physicallyseparated from the external electrodes 331 and 332. Because theconnection between the plating layer and the insulating layer is weak,there is a high possibility that the gap between the insulating layerand the plating layer will widen or foreign substances will penetrate.The possibility of delamination may increase as it becomes vulnerable toexternal shocks and the like.

According to an embodiment of the present disclosure, the averagethickness of the plating layer is less than the average thickness of theinsulating layer, and the contact area between the plating layer and theinsulating layer may be reduced. Accordingly, the occurrence ofdelamination may be suppressed and the bonding strength of themultilayer electronic component 3000 may be improved.

The size of the multilayer electronic component 3000 does not need to beparticularly limited.

However, to obtain miniaturization and high capacitance simultaneously,since the thickness of the dielectric layer and the internal electrodeshould be thinned to increase the number of layers, in the multilayerelectronic component 3000 having a size of 1005 (length×width, 1.0mm×0.5 mm) or less, the effect of improving reliability and capacitanceper unit volume according to the present disclosure may become moresignificant.

Therefore, considering manufacturing errors and external electrodesizes, when the length of the multilayer electronic component 3000 is1.1 mm or less and the width is 0.55 mm or less, the reliabilityimprovement effect according to the present disclosure may be moresignificant. In this case, the length of the multilayer electroniccomponent 3000 indicates a maximum size of the multilayer electroniccomponent 3000 in the second direction, and the width of the multilayerelectronic component 3000 may indicate a maximum size of the multilayerelectronic component 3000 in the third direction.

As set forth above, according to an embodiment, reliability of amultilayer electronic component may be improved while improvingcapacitance of the multilayer electronic component per unit volume bydisposing an insulating layer on the connection portion of the externalelectrode and a plating layer on the band portion of the externalelectrode.

In addition, the mounting space of the multilayer electronic componentmay be significantly reduced.

In addition, as the insulating layer includes an oxide containing Ba,moisture resistance reliability may be improved and crack generation andpropagation may be suppressed.

Although the embodiment of the present disclosure has been described indetail above, the present disclosure is not limited by theabove-described embodiment and the accompanying drawings, but isintended to be limited by the appended claims. Accordingly, varioustypes of substitution, modification and change will be possible by thoseskilled in the art within the scope not departing from the technicalspirit of the present disclosure described in the claims, and it is alsosaid that it falls within the scope of the present disclosure.

In addition, the expression ‘an/one embodiment’ used in the presentdisclosure does not mean the same embodiment as each other, and isprovided to emphasize and explain different unique features. However,one embodiment presented above is not excluded from being implemented incombination with the features of another embodiment. For example, evenif a matter described in one specific embodiment is not described inanother embodiment, it may be understood as a description related toanother embodiment unless a description contradicts or contradicts thematter in another embodiment.

The terms used in the present disclosure are used to describe only oneembodiment, and are not intended to limit the present disclosure. Inthis case, the singular expression includes the plural expression unlessthe context clearly indicates otherwise.

While embodiments have been shown and described above, it will beapparent to those skilled in the art that modifications and variationscould be made without departing from the scope of the present disclosureas defined by the appended claims.

1. A multilayer electronic component comprising: a body including adielectric layer and a first internal electrode and a second internalelectrode alternately disposed with the dielectric layer interposedtherebetween, the body having a first surface and a second surfaceopposing each other in a first direction, a third surface and a fourthsurface connected to the first and second surfaces and opposing eachother in a second direction, and a fifth surface and a sixth surfaceconnected to the first to fourth surfaces and opposing each other in athird direction; a first external electrode including a first connectionportion disposed on the third surface, a first band portion extendingfrom the first connection portion onto a portion of the first surface,and a third band portion extending from the first connection portiononto a portion of the second surface; a second external electrodeincluding a second connection portion disposed on the fourth surface, asecond band portion extending from the second connection portion onto aportion of the first surface, and a fourth band portion extending fromthe second connection portion onto a portion of the second surface; aninsulating layer disposed on the first and second connection portionsand covering the second surface and the third and fourth band portions;a first plating layer disposed on the first band portion; and a secondplating layer disposed on the second band portion, wherein theinsulating layer includes an oxide containing Ba.
 2. The multilayerelectronic component of claim 1, wherein the oxide containing the Baincludes BaO.
 3. The multilayer electronic component of claim 1, whereinamong elements constituting the insulating layer, a number of moles ofBa element relative to a total number of moles of elements other thanoxygen is 0.95 or more.
 4. The multilayer electronic component of claim1, wherein an average thickness of the insulating layer is 50 nm or moreand 3 μm or less.
 5. The multilayer electronic component of claim 1,further comprising a cover layer disposed on the insulating layer andincluding an insulating material.
 6. The multilayer electronic componentof claim 5, wherein the insulating material included in the cover layerincludes glass.
 7. The multilayer electronic component of claim 5,wherein the insulating material included in the cover layer is at leastone selected from an epoxy resin, an acrylic resin, and ethyl cellulose.8. The multilayer electronic component of claim 1, wherein H1>H2 issatisfied, in which H1 is an average distance from the first surface toan internal electrode closest to the first surface among the first andsecond internal electrodes in the first direction, and H2 is an averagedistance from an extension line of the first surface to ends of thefirst and second plating layers disposed on the first and secondconnection portions in the first direction.
 9. The multilayer electroniccomponent of claim 1, wherein H1<H2 is satisfied, in which H1 is anaverage distance from the first surface to an internal electrode closestto the first surface among the first and second internal electrodes inthe first direction, and H2 is an average distance from an extensionline of the first surface to ends of the first and second plating layersdisposed on the first and second connection portions in the firstdirection.
 10. The multilayer electronic component of claim 9, whereinH2<T/2, in which T is an average size of the body in the firstdirection.
 11. The multilayer electronic component of claim 1, whereinthe first and second plating layers are disposed below an extension lineof the first surface.
 12. The multilayer electronic component of claim1, wherein 0.2≤B1/L≤0.4 and 0.2≤B2/L≤0.4 are satisfied, in which L is anaverage size of the body in the second direction is L, B1 is an averagedistance from an extension line of the third surface to an end of thefirst band portion in the second direction, and B2 is an averagedistance from an extension line of the fourth surface to an end of thesecond band portion in the second direction.
 13. The multilayerelectronic component of claim 1, further comprising an additionalinsulating layer disposed on the first surface and disposed between thefirst band portion and the second band portion.
 14. The multilayerelectronic component of claim 13, wherein the additional insulatinglayer includes an oxide containing Ba.
 15. The multilayer electroniccomponent of claim 1, wherein the first and second external electrodesinclude at least one of Ni and a Ni alloy.
 16. The multilayer electroniccomponent of claim 1, wherein B3<B1 and B4<B2 are satisfied, in which B1is an average distance from an extension line of the third surface to anend of the first band portion in the second direction, B2 is an averagedistance from an extension line of the fourth surface to an end of thesecond band portion in the second direction, B3 is an average distancefrom the extension line of the third surface to an end of the third bandportion in the second direction, and B4 is an average distance from theextension line of the fourth surface to an end of the fourth bandportion in the second direction.
 17. The multilayer electronic componentof claim 1, wherein a maximum size of the multilayer electroniccomponent in the second direction is 1.1 mm or less, and a maximum sizeof the multilayer electronic component in the third direction is 0.55 mmor less.
 18. The multilayer electronic component of claim 1, wherein anaverage thickness of the dielectric layer is 0.35 μm or less.
 19. Themultilayer electronic component of claim 1, wherein an average thicknessof the first and second internal electrodes is 0.35 μm or less.
 20. Themultilayer electronic component of claim 1, wherein the body includes acapacitance formation portion including the first and second internalelectrodes alternately disposed with the dielectric layer therebetween,and a cover portion disposed on both end surfaces of the capacitanceformation portion in the first direction, wherein an average size of thecover portion in the first direction is 15 μm or less.
 21. Themultilayer electronic component of claim 1, wherein an average thicknessof the first and second plating layers is less than an average thicknessof the insulating layer.
 22. The multilayer electronic component ofclaim 1, wherein the first plating layer is disposed to cover an end ofthe insulating layer disposed on the first external electrode, and thesecond plating layer is disposed to cover another end of the insulatinglayer disposed on the second external electrode.
 23. The multilayerelectronic component of claim 1, wherein the insulating layer isdisposed to cover an end of the first plating layer disposed on thefirst external electrode, and the insulating layer is disposed to coveran end of the second plating layer disposed on the second externalelectrode.
 24. The multilayer electronic component of claim 1, whereinthe first external electrode comprises a first side band portionextending from the first connection portion onto a portion of the fifthand sixth surfaces, and the second external electrode comprises a secondside band portion extending from the second connection portion onto aportion of the fifth and sixth surfaces, wherein a size of the first andsecond side band portions in the second direction increases as the firstand second side band portions approach the first surface.
 25. Themultilayer electronic component of claim 1, wherein the first externalelectrode comprises a first side band portion extending from the firstconnection portion onto a portion of the fifth and sixth surfaces, thesecond external electrode comprises a second side band portion extendingfrom the second connection portion onto a portion of the fifth and sixthsurfaces, and the insulating layer is disposed to cover the first andsecond side band portions and portions of the fifth surface and thesixth surface.
 26. The multilayer electronic component of claim 1,wherein the first external electrode includes a first side band portionextending from the first connection portion onto a portion of the fifthand sixth surfaces, the second external electrode includes a second sideband portion extending from the second connection portion onto a portionof the fifth and sixth surfaces, and the insulating layer is disposed tocover the entirety of the first and second side band portions and thefifth and sixth surfaces.
 27. The multilayer electronic component ofclaim 1, wherein B3≥GT and B4≥G2 are satisfied, in which B3 is anaverage distance from an extension line of the third surface to an endof the third band portion in the second direction, B4 is an averagedistance from an extension line of the fourth surface to an end of thefourth band portion in the second direction, G1 is an average size of aregion in which the third surface and the second internal electrode arespaced apart, in the second direction, and G2 is an average size of aregion in which the fourth surface and the first internal electrode arespaced apart, in the second direction.
 28. The multilayer electroniccomponent of claim 27, wherein B1≥GT and B2≥G2 are satisfied, in whichB1 is an average distance from the extension line of the third surfaceto an end of the first band portion in the second direction and B2 is anaverage distance from the extension line of the fourth surface to an endof the second band portion in the second direction.
 29. The multilayerelectronic component of claim 1, wherein the body comprises a 1-3 edgeconnecting the first surface and the third surface, a 1-4 edgeconnecting the first surface and the fourth surface, a 2-3 edgeconnecting the second surface and the third surface, and a 2-4 edgeconnecting the second surface and the fourth surface, wherein the 1-3edge and the 2-3 edge have a form contracted toward a center of the bodyin the first direction as the 1-3 edge and the 2-3 edge approach thethird surface, and the 1-4 edge and the 2-4 edge have a form contractedtoward the center of the body in the first direction as the 1-4 edge andthe 2-4 edge approach the fourth surface, and the first externalelectrode includes edge portions disposed on the 1-3 edge and the 2-3edge, and the second external electrode includes edge portions disposedon the 1-4 edge and the 2-4 edge. 30-124. (canceled)